Details
BUY TD62081AP https://www.utsource.net/itm/p/12608562.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | - | 4.5 | - | 18 | V |
| Output Current (Continuous) | IO(max) | Ta = 25掳C | - | 50 | - | mA |
| Output Current (Pulse) | IO(pulse) | Ta = 25掳C, t = 100 渭s | - | 150 | - | mA |
| Quiescent Current | IQ | VCC = 5V, no load | - | 1 | - | mA |
| Operating Temperature Range | Ta | - | -40 | - | 85 | 掳C |
| Storage Temperature Range | Tstg | - | -65 | - | 150 | 掳C |
| Junction Temperature | Tj | - | - | - | 150 | 掳C |
| Thermal Resistance (Junction to Ambient) | R胃JA | - | - | 150 | - | 掳C/W |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (VCC) is within the range of 4.5V to 18V.
- Avoid exceeding the maximum supply voltage to prevent damage to the device.
Output Current:
- The continuous output current should not exceed 50mA at 25掳C ambient temperature.
- For pulse applications, the output current can be up to 150mA for a duration of 100 渭s at 25掳C ambient temperature.
Quiescent Current:
- The quiescent current is typically 1mA when the supply voltage is 5V and there is no load.
Temperature Considerations:
- The operating temperature range is from -40掳C to 85掳C.
- The storage temperature range is from -65掳C to 150掳C.
- The junction temperature should not exceed 150掳C.
Thermal Management:
- The thermal resistance from the junction to ambient (R胃JA) is 150掳C/W. Proper heat sinking may be required if the device is operated at high power levels or in high-temperature environments.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper mounting to a suitable PCB with adequate copper area for heat dissipation.
- Follow the recommended PCB layout guidelines provided by the manufacturer to ensure optimal performance and reliability.
Testing:
- Before final assembly, test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury.
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