Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 65 | - | V | |
| Gate-Source Voltage | VGS | -20 | - | 20 | V | |
| Continuous Drain Current | ID | - | 20 | - | A | @ TC = 25掳C |
| Power Dissipation | PTOT | - | 180 | - | W | @ TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C |
Instructions:
Handling Precautions:
- Handle the device with care to avoid damage.
- Use proper ESD (Electrostatic Discharge) protection when handling the device.
Mounting and Soldering:
- Ensure that the mounting surface is clean and flat.
- Use a soldering iron with a temperature not exceeding 300掳C.
- Avoid applying excessive heat for prolonged periods to prevent thermal damage.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Ensure adequate heat sinking to maintain the junction temperature within safe limits.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Keep the device in its original packaging until ready for use.
Testing:
- Perform initial testing under controlled conditions to ensure the device is functioning correctly.
- Refer to the datasheet for detailed test procedures and recommended test circuits.
Applications:
- Suitable for high-power switching applications, motor control, and power supply circuits.
- Ensure that the device is used within its specified operating parameters to avoid premature failure.
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