2SK1023

2SK1023


Specifications
Details

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Parameter Symbol Value Unit Conditions
Drain-Source Voltage (Max) VDS(max) 200 V
Gate-Source Voltage (Max) VGS(max) 卤20 V
Continuous Drain Current (Max) ID(max) 5 A TC = 25掳C
Pulse Drain Current (Max) IDP(max) 10 A tp = 10ms, TC = 25掳C
Power Dissipation (Max) PD(max) 40 W TC = 25掳C
Junction Temperature (Max) TJ(max) 175 掳C
Storage Temperature Range TSTG -55 to 150 掳C

Instructions for Use:

  1. Mounting and Handling:

    • Handle the device with care to avoid damage to the leads.
    • Ensure proper mounting to a heatsink if operating near maximum power dissipation.
  2. Biasing:

    • Apply gate voltage within the specified limits to prevent damage.
    • Ensure that the gate-source voltage does not exceed 卤20V to avoid gate oxide breakdown.
  3. Operation:

    • Operate within the continuous and pulse drain current ratings based on thermal conditions.
    • Keep the junction temperature below 175掳C to ensure reliable operation.
  4. Storage:

    • Store in a dry environment within the temperature range of -55掳C to 150掳C.
  5. Safety:

    • Always use appropriate safety measures when handling high voltages or currents.
    • Follow all relevant electrical safety guidelines during installation and testing.
(For reference only)

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