PAL16L8ACN.

PAL16L8ACN.


Specifications
SKU
12608667
Details

BUY PAL16L8ACN. https://www.utsource.net/itm/p/12608667.html

Parameter Description Value
Package Type The type of package 20-Pin DIP
Operating Voltage The range of operating voltages 4.5V to 5.5V
Power Consumption Maximum power consumption at maximum operating conditions 100mW
Propagation Delay Typical propagation delay time 12ns
Fan-out Number of standard TTL loads that can be driven 10
Operating Temperature Range of temperatures for operation -40掳C to +85掳C
Storage Temperature Range of temperatures for storage -65掳C to +150掳C
Input Current Maximum input current per pin 卤1mA
Output Current Maximum output current per pin 卤15mA
Input Capacitance Capacitance of each input pin 15pF
Output Capacitance Capacitance of each output pin 15pF
Programming Voltage Voltage required for programming 12.5V
Programming Time Time required for programming 10ms
Erasure Time Time required for erasure (if applicable) Not Applicable
Programmable Terms Number of programmable terms (AND gates) 16
Macrocells Number of macrocells (OR gates) 8
Polarity Output polarity options Both (Positive and Negative)
Functionality Type of logic functions supported Combinatorial and Sequential

Instructions for Using PAL16L8ACN

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (4.5V to 5.5V).
    • Use a stable power supply to avoid fluctuations.
  2. Pin Configuration:

    • Refer to the datasheet for the pinout diagram.
    • Connect VCC to the positive supply and GND to the ground.
  3. Programming:

    • Use a compatible programmer to program the device.
    • Apply the programming voltage (12.5V) to the appropriate pins as specified in the datasheet.
    • Follow the programming sequence provided by the manufacturer.
  4. Input Handling:

    • Ensure input signals are within the valid logic levels (0V to 5V).
    • Do not exceed the maximum input current of 卤1mA.
  5. Output Handling:

    • Do not exceed the maximum output current of 卤15mA.
    • Use pull-up or pull-down resistors if necessary to ensure proper logic levels.
  6. Temperature Considerations:

    • Operate the device within the specified temperature range (-40掳C to +85掳C).
    • Store the device within the storage temperature range (-65掳C to +150掳C).
  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry, cool place to prevent moisture damage.
  8. Testing:

    • After programming, test the device to ensure it meets the desired functionality.
    • Use a logic analyzer or similar tool to verify the output signals.
  9. Soldering:

    • Use a soldering iron with a temperature-controlled tip to avoid overheating.
    • Follow the recommended soldering profile to ensure reliable connections.
  10. Documentation:

    • Always refer to the latest datasheet and application notes for detailed information and updates.
(For reference only)

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