Details

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Parameter	Description	Value
Device Type	20V CMOS Low Power Programmable Logic Device	-
Package	PLCC-20	-
Operating Voltage (Vcc)	Supply Voltage Range	3.0V to 5.5V
Standby Current (Icc)	Supply Current at Vcc = 5V, T = 25掳C	10 渭A
Maximum Power Dissipation (Pd)	At Vcc = 5V, T = 25掳C	100 mW
Operating Temperature (Toper)	Junction Temperature Range	-40掳C to +85掳C
Storage Temperature (Tstg)	Storage Temperature Range	-65掳C to +150掳C
Input High Voltage (VIH)	Minimum Input High Voltage at Vcc = 5V	3.5V
Input Low Voltage (VIL)	Maximum Input Low Voltage at Vcc = 5V	1.5V
Output High Voltage (VOH)	Minimum Output High Voltage at Vcc = 5V, IOL = -4mA	4.5V
Output Low Voltage (VOL)	Maximum Output Low Voltage at Vcc = 5V, IOH = 4mA	0.5V
Propagation Delay Time (tpd)	Typical Propagation Delay Time at Vcc = 5V, T = 25掳C	15 ns
Power-down Mode	Active Low Pin for Power-down	PD (Pin 1)
Programming Voltage (Vpp)	Programming Voltage	12.75V 卤 0.25V
Programming Current (Ipp)	Programming Current	250 渭A
Erasure Time	UV Erasure Time	20 minutes (typical)

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 3.0V to 5.5V.
   • Connect the power supply to the Vcc pin (Pin 20) and ground (GND) pin (Pin 10).

2. Power-down Mode:

   • To enter power-down mode, set the PD pin (Pin 1) to a low logic level (0V).
   • To exit power-down mode, set the PD pin to a high logic level (Vcc).

3. Input and Output Levels:

   • Ensure input signals meet the VIH and VIL specifications.
   • Ensure output signals are within the VOH and VOL specifications.

4. Programming:

   • Apply the programming voltage (Vpp) of 12.75V 卤 0.25V to the appropriate pins during programming.
   • Follow the specific programming algorithm provided by the manufacturer.

5. Handling:

   • Handle the device with care to avoid static damage.
   • Store the device in a temperature-controlled environment between -65掳C and +150掳C.

6. Temperature Considerations:

   • Operate the device within the specified operating temperature range of -40掳C to +85掳C.
   • Monitor the junction temperature to ensure it does not exceed the maximum rating.

7. Mounting:

   • Ensure proper soldering and mounting to the PCB to maintain electrical and thermal performance.
   • Follow the recommended PCB layout guidelines provided by the manufacturer.

8. Testing:

   • Perform initial testing at room temperature (25掳C) to verify functionality.
   • Conduct additional tests under different operating conditions as required.

(For reference only)