SH2008B

SH2008B


Specifications
SKU
12608717
Details

BUY SH2008B https://www.utsource.net/itm/p/12608717.html

Parameter Description Value
Part Number Device Identifier SH2008B
Type Device Type Hall Effect Switch
Operating Voltage (VCC) Supply Voltage Range 3.0V to 5.5V
Output Type Output Configuration Open Collector
Output Current (IO) Maximum Output Current 20mA
Quiescent Current (ICC) Supply Current 1.6渭A (Typical)
Magnetic Sensitivity (BOP) Operate Point Magnetic Flux Density -35 Gauss (Typical)
Release Point (BRP) Release Point Magnetic Flux Density -20 Gauss (Typical)
Hysteresis (BHYS) Magnetic Hysteresis 15 Gauss (Typical)
Operating Temperature (TOPR) Operating Temperature Range -40掳C to 85掳C
Storage Temperature (TSTG) Storage Temperature Range -55掳C to 150掳C
Package Type Package Style SOT-23

Instructions for Use

  1. Supply Voltage (VCC):

    • Connect the VCC pin to a stable power supply within the range of 3.0V to 5.5V.
    • Ensure the power supply is clean and free from excessive noise.
  2. Ground (GND):

    • Connect the GND pin to the system ground to ensure proper operation and stability.
  3. Output (OUT):

    • The output is an open collector configuration, which means it can sink current but not source it.
    • Connect a pull-up resistor between the output pin and the supply voltage (VCC) to set the high state level.
    • The typical value for the pull-up resistor is 10k惟, but this can be adjusted based on your application requirements.
  4. Magnetic Field Sensing:

    • Place the device in the magnetic field you wish to detect.
    • The device will switch its output state when the magnetic flux density exceeds the operate point (BOP) and return to the original state when it falls below the release point (BRP).
  5. Temperature Considerations:

    • Ensure the operating temperature remains within the specified range (-40掳C to 85掳C).
    • Store the device in a location where the temperature does not exceed the storage temperature range (-55掳C to 150掳C).
  6. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  7. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) processes.
    • Ensure proper soldering and alignment to prevent mechanical stress and ensure reliable operation.

By following these instructions, you can ensure optimal performance and reliability of the SH2008B Hall Effect Switch in your application.

(For reference only)

View more about SH2008B on main site