Details

---

BUY MM74C906N. https://www.utsource.net/itm/p/12608746.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC		4.75	5.0	5.25	V
Output High Voltage	VOH	IO = -0.4 mA, VCC = 5V	2.4	2.7	3.5	V
Output Low Voltage	VOL	IO = 16 mA, VCC = 5V	0.0	0.4	0.5	V
Input High Voltage	VIH	II = -0.4 mA, VCC = 5V	2.0	3.0	5.0	V
Input Low Voltage	VIL	II = 1.0 mA, VCC = 5V	0.0	0.8	1.5	V
Propagation Delay Time	tp	VCC = 5V, TA = 25掳C	15	25	35	ns
Power Dissipation	PD	Continuous, per package	-	-	100	mW
Operating Temperature	TA		-40	-	85	掳C
Storage Temperature	TSTG		-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply input signals such that the high level (V_IH) is at least 2.0V and the low level (V_IL) is no more than 1.5V when V_CC is 5V.
   • Ensure that input currents do not exceed the maximum ratings.

3. Output Signals:

   • When the output is high, the voltage (V_OH) should be at least 2.4V and typically around 2.7V when V_CC is 5V.
   • When the output is low, the voltage (V_OL) should be no more than 0.5V when V_CC is 5V.
   • Ensure that output currents do not exceed the maximum ratings to avoid damage.

4. Propagation Delay:

   • The propagation delay time (t_p) is the time it takes for the output to change state after the input changes. It should be within 15 to 35 nanoseconds under typical conditions.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.
   • Store the device in an environment where the temperature does not exceed -65掳C to 150掳C.

6. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Store the device in a dry, cool place to prevent moisture damage.

7. Mounting:

   • Ensure proper soldering techniques to avoid thermal shock and mechanical stress.
   • Use appropriate heat sinks if necessary to manage power dissipation.

8. Testing:

   • Test the device under controlled conditions to verify its functionality before integrating it into a larger system.

(For reference only)