FDP2532.

FDP2532.


Specifications
SKU
12608750
Details

BUY FDP2532. https://www.utsource.net/itm/p/12608750.html

Parameter Symbol Min Typ Max Unit Description
Drain-Source Voltage VDS - 30 - V Maximum voltage that can be applied between drain and source
Gate-Source Voltage VGS -10 - 10 V Maximum voltage that can be applied between gate and source
Continuous Drain Current ID - 32 - A Continuous current that can flow through the drain
Pulse Drain Current ID(p) - 64 - A Peak pulse current that can flow through the drain (tp = 10 渭s)
Power Dissipation PD - 78 - W Maximum power dissipation at TC = 25掳C
Junction Temperature TJ - - 150 掳C Maximum junction temperature
Storage Temperature TSTG -55 - 150 掳C Temperature range for storage and operation

Instructions:

  1. Handling Precautions:

    • The FDP2532 is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures when handling the device.
    • Avoid exceeding the maximum ratings specified in the table to prevent damage.
  2. Mounting and Soldering:

    • Ensure that the device is mounted on a heatsink if operating at high power levels to maintain the junction temperature within safe limits.
    • Follow the recommended soldering profile to avoid thermal shock and ensure good thermal and electrical connections.
  3. Gate Drive:

    • Apply a gate-source voltage (VGS) within the specified range to turn the device on or off.
    • For optimal performance, use a gate resistor to control the rise and fall times of the gate voltage, reducing switching losses and electromagnetic interference (EMI).
  4. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
    • Use thermal vias and appropriate PCB layout techniques to enhance heat dissipation.
  5. Testing:

    • When testing the device, start with low currents and voltages to verify correct operation before increasing to higher levels.
    • Use a current-limited power supply to protect the device during testing.
  6. Storage:

    • Store the device in a dry, cool environment within the specified storage temperature range (-55掳C to 150掳C).
    • Keep the device in its original packaging until ready for use to protect against moisture and static damage.
(For reference only)

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