Details
BUY IXTQ36N30P https://www.utsource.net/itm/p/12608761.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 300 | V | |
| Gate-Source Voltage | VGS | -20 | - | 20 | V | |
| Continuous Drain Current | ID | - | 36 | - | A | TC = 25掳C |
| Continuous Drain Current | ID | - | 27 | - | A | TC = 100掳C |
| Pulse Drain Current | ID(peak) | - | 108 | - | A | tp = 10 渭s, IG = 10 A |
| Total Power Dissipation | PTOT | - | 240 | - | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C | |
| Thermal Resistance, Junction to Case | R胃JC | - | 0.5 | - | 掳C/W | |
| Input Capacitance | Ciss | - | 2900 | - | pF | VGS = 15 V, f = 1 MHz |
| Output Capacitance | Coss | - | 210 | - | pF | VDS = 150 V, f = 1 MHz |
| Reverse Transfer Capacitance | Crss | - | 180 | - | pF | VDS = 150 V, VGS = 0 V, f = 1 MHz |
| Gate Charge | QG | - | 110 | - | nC | VGS = 15 V |
| Turn-on Delay Time | td(on) | - | 55 | - | ns | ID = 36 A, VGS = 15 V, RG = 2 惟 |
| Rise Time | tr | - | 70 | - | ns | ID = 36 A, VGS = 15 V, RG = 2 惟 |
| Turn-off Delay Time | td(off) | - | 50 | - | ns | ID = 36 A, VGS = 15 V, RG = 2 惟 |
| Fall Time | tf | - | 75 | - | ns | ID = 36 A, VGS = 15 V, RG = 2 惟 |
Instructions for Use:
Handling and Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Handle with care to avoid static discharge, which can damage the device.
Mounting:
- Ensure proper heat sinking to manage thermal resistance and maintain the junction temperature within safe limits.
- Use a thermal compound between the device and the heat sink to improve thermal conductivity.
Biasing:
- Apply the gate-source voltage (VGS) carefully to avoid exceeding the maximum ratings.
- Use appropriate gate resistors to control the turn-on and turn-off times and reduce switching losses.
Operation:
- Operate the device within the specified drain-source voltage (VDS) and continuous drain current (ID) limits.
- Monitor the junction temperature (TJ) to ensure it does not exceed 175掳C.
Testing:
- When testing the device, use the recommended test conditions to ensure accurate measurements.
- Use a suitable test setup to avoid over-stressing the device.
Safety:
- Always follow safety guidelines when working with high voltages and currents.
- Ensure that the device is properly isolated from other circuits to prevent short circuits and damage.
By adhering to these parameters and instructions, you can ensure reliable and efficient operation of the IXTQ36N30P MOSFET.
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