Details
BUY IRFP4321 https://www.utsource.net/itm/p/12608844.html
| Parameter | Symbol | Min | Typical | Max | Unit | Condition |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 55 | V | |
| Gate-Source Voltage | VGS | -10 | - | 10 | V | |
| Continuous Drain Current | ID | - | 12 | - | A | TC = 25掳C |
| Pulse Drain Current | ID(p) | - | 36 | - | A | tp = 10 ms, IG = 10 A, TC = 25掳C |
| Power Dissipation | PD | - | - | 120 | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | |
| Storage Temperature | Tstg | -55 | - | 150 | 掳C | |
| Thermal Resistance, Junction to Case | R胃JC | - | 0.5 | - | 掳C/W | |
| Input Capacitance | Ciss | - | 1800 | - | pF | VDS = 20 V, f = 1 MHz |
| Output Capacitance | Coss | - | 480 | - | pF | VDS = 20 V, f = 1 MHz |
| Reverse Transfer Capacitance | Crss | - | 290 | - | pF | VDS = 20 V, f = 1 MHz |
| Gate Charge | QG | - | 75 | - | nC | VDS = 20 V, VGS = 10 V, ID = 12 A |
| Threshold Voltage | VGS(th) | 2 | 4 | 6 | V | ID = 250 渭A |
| On-State Resistance | RDS(on) | - | 0.045 | - | 惟 | VGS = 10 V, ID = 12 A, TC = 25掳C |
Instructions for Use:
Mounting and Handling:
- Ensure proper heat sinking to manage the power dissipation.
- Handle with care to avoid damage to the gate, which is sensitive to electrostatic discharge (ESD).
Biasing:
- Apply the appropriate gate-source voltage (VGS) to control the drain current (ID).
- Ensure VGS does not exceed the maximum rating to prevent damage.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it stays within safe limits.
- Use thermal grease or thermal pads between the device and the heat sink for better thermal conductivity.
Pulse Operation:
- For pulse operation, ensure the pulse duration (tp) and duty cycle are within the specified limits to avoid overheating.
Capacitance Considerations:
- Account for the input, output, and reverse transfer capacitances in high-frequency applications to minimize switching losses.
Storage and Operating Conditions:
- Store the device within the specified storage temperature range to prevent damage.
- Operate the device within the recommended operating conditions to ensure reliable performance.
Testing:
- Test the device under controlled conditions to verify its performance parameters before integrating it into the final application.
View more about IRFP4321 on main site
