Details

---

BUY NCP1337P https://www.utsource.net/itm/p/12608847.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	VIN	4.5	-	28	V	Operating range
Output Voltage	VOUT	-	3.3	-	V	Fixed output voltage
Output Current	IOUT	-	300	-	mA	Maximum continuous output current
Quiescent Current	IQ	-	25	-	渭A	At no load
Dropout Voltage	VDROP	-	1.2	-	V	At full load
Power Dissipation	PD	-	-	1.5	W	Maximum power dissipation
Operating Temperature	TOP	-40	-	125	掳C	Junction temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
Thermal Resistance	胃JA	-	80	-	掳C/W	Junction to ambient thermal resistance (TO-220 package)

Instructions for Use:

1. Input Voltage:

   • Ensure the input voltage is within the specified range (4.5V to 28V). Exceeding this range can damage the device.

2. Output Voltage:

   • The NCP1337P provides a fixed output voltage of 3.3V. No external components are required for voltage setting.

3. Output Current:

   • The maximum continuous output current is 300mA. Ensure that the load does not exceed this limit to avoid overheating or damage.

4. Quiescent Current:

   • The quiescent current is typically 25渭A at no load. This is important for low-power applications.

5. Dropout Voltage:

   • The dropout voltage is typically 1.2V at full load. Ensure that the input voltage is at least 1.2V higher than the output voltage to maintain regulation.

6. Power Dissipation:

   • The maximum power dissipation is 1.5W. Proper heat sinking may be required if operating near this limit to prevent overheating.

7. Operating Temperature:

   • The device can operate over a junction temperature range of -40掳C to 125掳C. Ensure adequate cooling if operating in high-temperature environments.

8. Storage Temperature:

   • The device can be stored between -65掳C and 150掳C. Avoid exposing the device to extreme temperatures for extended periods.

9. Thermal Resistance:

   • The thermal resistance from junction to ambient (胃_JA) is 80掳C/W for the TO-220 package. Use appropriate heat sinks to manage thermal performance.

10. Mounting and Handling:

    • Follow standard handling procedures for electronic components to avoid static damage. Ensure proper mounting and soldering techniques to prevent mechanical stress.

11. Capacitors:

    • Use appropriate input and output capacitors to ensure stability and filter noise. Typical values are 10渭F for input and 10渭F for output, but consult the datasheet for specific recommendations.

12. PCB Layout:

    • Optimize the PCB layout to minimize trace lengths and parasitic inductances, especially for the input and output paths. Ground planes should be used to improve thermal performance and reduce noise.

(For reference only)