Details

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BUY FMU16S https://www.utsource.net/itm/p/12608862.html

Parameter	Description	Min	Typ	Max	Unit
VCC	Supply Voltage	4.5	5.0	5.5	V
ICC	Supply Current (Active)	-	10	30	mA
ICC (Standby)	Supply Current (Standby)	-	1	5	渭A
fIN	Input Frequency Range	30	-	120	kHz
fOUT	Output Frequency Range	30	-	120	kHz
VIH	Input High Voltage Level	3.0	-	5.5	V
VIL	Input Low Voltage Level	0.0	-	0.8	V
VOH	Output High Voltage Level	3.5	-	5.0	V
VOL	Output Low Voltage Level	0.0	-	0.4	V
tpd	Propagation Delay Time	10	20	30	ns
tr	Rise Time	5	10	15	ns
tf	Fall Time	5	10	15	ns
Operating Temperature	Temperature Range	-40	-	85	掳C
Storage Temperature	Temperature Range	-65	-	150	掳C

Instructions for FMU16S

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signal:

   • The input frequency (f_IN) should be between 30kHz and 120kHz.
   • The input high voltage level (V_IH) should be at least 3.0V.
   • The input low voltage level (V_IL) should not exceed 0.8V.

3. Output Signal:

   • The output frequency (f_OUT) will match the input frequency within the same range (30kHz to 120kHz).
   • The output high voltage level (V_OH) will be at least 3.5V.
   • The output low voltage level (V_OL) will not exceed 0.4V.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 20ns but can range from 10ns to 30ns.

5. Rise and Fall Times:

   • The rise time (t_r) and fall time (t_f) are both typically 10ns but can range from 5ns to 15ns.

6. Temperature Considerations:

   • The device operates within a temperature range of -40掳C to 85掳C.
   • Store the device in an environment with a temperature range of -65掳C to 150掳C.

7. Power Consumption:

   • In active mode, the supply current (I_CC) is typically 10mA but can range from 10mA to 30mA.
   • In standby mode, the supply current (I_CC (Standby)) is typically 1渭A but can range from 1渭A to 5渭A.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge.
   • Store the device in a dry, cool place to prevent damage.

9. Mounting:

   • Ensure proper soldering and mounting to avoid mechanical stress on the pins.
   • Use appropriate heat sinks if necessary to manage thermal dissipation.

10. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.

(For reference only)