HIP5600IS.

HIP5600IS.


Specifications
SKU
12608873
Details

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Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage 4.5 - 28 V
Output Current (IO) Maximum output current per channel - 1.5 - A
Operating Temperature (TA) Ambient temperature range -40 - 125 掳C
Storage Temperature (TSTG) Temperature range for storage -65 - 150 掳C
Thermal Resistance (胃JA) Junction-to-ambient thermal resistance - 70 - 掳C/W
Quiescent Current (IQ) Supply current at no load - 15 - mA
Input Voltage (VIN) Input voltage range for logic inputs 0 - 5.5 V
Rise Time (tR) Output rise time - 1.5 - 渭s
Fall Time (tF) Output fall time - 1.5 - 渭s
Propagation Delay (tPD) Propagation delay time - 1.0 - 渭s
Maximum Power Dissipation (PDMAX) Maximum power dissipation - 1.35 - W

Instructions for HIP5600IS:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 28V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Output Current:

    • The maximum output current per channel is 1.5A. Do not exceed this limit to prevent damage to the device.
    • Use appropriate heat sinking if operating near the maximum current to manage thermal dissipation.
  3. Operating Temperature:

    • The ambient temperature range is from -40掳C to 125掳C. Ensure the device operates within this range to maintain reliability.
    • For extended operation in high-temperature environments, consider additional cooling measures.
  4. Storage Temperature:

    • Store the device in a temperature range of -65掳C to 150掳C to ensure long-term stability and performance.
  5. Thermal Resistance:

    • The junction-to-ambient thermal resistance (胃JA) is 70掳C/W. Use this value to calculate the required heat sink size if necessary.
  6. Quiescent Current:

    • The quiescent current (IQ) is typically 15mA. This is the current drawn by the device when no load is connected.
  7. Input Voltage:

    • The input voltage (VIN) for logic inputs should be within the range of 0V to 5.5V to ensure proper operation.
  8. Rise and Fall Times:

    • The typical rise time (tR) and fall time (tF) are both 1.5渭s. These values are important for timing considerations in your circuit design.
  9. Propagation Delay:

    • The propagation delay time (tPD) is typically 1.0渭s. This is the time it takes for a change in the input to affect the output.
  10. Maximum Power Dissipation:

    • The maximum power dissipation (PDMAX) is 1.35W. Ensure that the device does not exceed this limit to avoid overheating and potential failure.
  11. General Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
  12. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress and ensure good thermal contact with any heat sinks or cooling solutions.
  13. Testing:

    • Before finalizing the design, perform thorough testing under all expected operating conditions to ensure reliable performance.
(For reference only)

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