Details

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BUY SPD07N20 https://www.utsource.net/itm/p/12608893.html

Parameter	Symbol	Test Conditions	Min	Typical	Max	Unit
Drain-Source Voltage	VDS	-	-	200	-	V
Gate-Source Voltage	VGS	-	-15	0	15	V
Continuous Drain Current (TC = 25°C)	ID(25°C)	VDS = 20V, TC = 25°C	-	7	-	A
Continuous Drain Current (TC = 75°C)	ID(75°C)	VDS = 20V, TC = 75°C	-	4.5	-	A
Pulse Drain Current (tp = 10ms, frep ≤ 100Hz)	IDM	VDS = 20V, tp = 10ms, frep ≤ 100Hz	-	28	-	A
Total Power Dissipation (TC = 25°C)	PTOT(25°C)	TC = 25°C	-	125	-	W
Total Power Dissipation (TC = 75°C)	PTOT(75°C)	TC = 75°C	-	65	-	W
Junction Temperature	TJ	-	-55	-	175	°C
Storage Temperature Range	TSTG	-	-55	-	150	°C
Gate Charge	QG	VGS = 10V, ID = 7A	-	25	-	nC
Input Capacitance	Ciss	VDS = 20V, f = 1MHz	-	1300	-	pF
Output Capacitance	Coss	VDS = 20V, f = 1MHz	-	220	-	pF
Reverse Transfer Capacitance	Crss	VDS = 20V, f = 1MHz	-	110	-	pF

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 200V.
   • The gate-source voltage (V_GS) should be within the range of -15V to +15V.

2. Current Ratings:

   • The continuous drain current (I_D) at 25°C is 7A, and at 75°C it is 4.5A.
   • For pulse conditions, the maximum pulse drain current (I_DM) is 28A with a pulse width of 10ms and a repetition rate of ≤ 100Hz.

3. Power Dissipation:

   • The total power dissipation (P_TOT) at 25°C is 125W, and at 75°C it is 65W.
   • Ensure adequate heat sinking to manage power dissipation and keep the junction temperature within safe limits.

4. Temperature:

   • The junction temperature (T_J) should not exceed 175°C.
   • The storage temperature range (T_STG) is from -55°C to 150°C.

5. Capacitance and Charge:

   • The input capacitance (C_iss) is 1300pF at V_DS = 20V.
   • The output capacitance (C_oss) is 220pF at V_DS = 20V.
   • The reverse transfer capacitance (C_rss) is 110pF at V_DS = 20V.
   • The gate charge (Q_G) is 25nC at V_GS = 10V and I_D = 7A.

6. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry environment within the specified storage temperature range.

7. Mounting:

   • Ensure proper mounting to maintain thermal performance and mechanical integrity.
   • Follow recommended PCB layout guidelines for optimal performance and reliability.

(For reference only)