Details

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BUY 24N60M2 https://www.utsource.net/itm/p/12608924.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Maximum Drain Current	ID	-	-	60	A	@ VGS = 15V, Tc = 25掳C
Maximum Gate-Source Voltage	VGS	-20	-	20	V
Maximum Drain-Source Voltage	VDS	-	-	700	V
Maximum Power Dissipation	PD	-	-	240	W	@ Tc = 25掳C
Junction Temperature	TJ	-55	-	175	掳C
Storage Temperature	TSTG	-55	-	175	掳C
Thermal Resistance, Junction to Case	R胃JC	-	0.5	-	掳C/W

Instructions for Use:

1. Handling Precautions:

   • Handle the 24N60M2 with care to avoid damage to the leads and body.
   • Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.

2. Mounting:

   • Ensure that the mounting surface is clean and flat to achieve good thermal contact.
   • Apply a suitable thermal compound between the device and the heatsink to enhance heat dissipation.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Ensure adequate cooling to keep the junction temperature within the specified range.

4. Gate Drive:

   • Use a gate resistor to limit the gate current and protect the gate from voltage spikes.
   • Ensure the gate-source voltage (VGS) is within the specified limits to avoid damaging the device.

5. Storage:

   • Store the 24N60M2 in a dry, cool place away from direct sunlight and corrosive substances.
   • Follow recommended storage temperature limits to prevent degradation.

6. Testing:

   • Use appropriate test equipment and methods to ensure accurate measurements.
   • Refer to the datasheet for specific test conditions and procedures.

7. Soldering:

   • Use a soldering iron with a temperature-controlled tip to avoid overheating the device.
   • Follow the recommended soldering profile to ensure reliable connections without damaging the component.

(For reference only)