Details

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BUY G4BC30U https://www.utsource.net/itm/p/12608955.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	V_IN	8	-	40	V	Operating input voltage range
Output Voltage	V_OUT	5	-	12	V	Adjustable output voltage
Output Current	I_OUT	-	3	5	A	Maximum continuous output current
Quiescent Current	I_Q	-	10	20	渭A	Quiescent current at no load
Efficiency	畏	-	90	-	%	Typical efficiency at full load
Switching Frequency	f_SW	300	-	600	kHz	Switching frequency
Dropout Voltage	V_DROPOUT	-	1.2	1.8	V	Dropout voltage at maximum load
Operating Temperature	T_OP	-40	-	85	掳C	Operating temperature range
Storage Temperature	T_STG	-65	-	150	掳C	Storage temperature range
Protection Features	-	-	-	-	-	Overcurrent, overvoltage, thermal

Instructions for Using G4BC30U

1. Input Connection:

   • Connect the input voltage (V_IN) to the VIN pin.
   • Ensure the input voltage is within the specified range (8V to 40V).

2. Output Configuration:

   • Adjust the output voltage (V_OUT) using the external resistors connected to the FB (Feedback) pin.
   • The output voltage can be set between 5V and 12V.

3. Output Load:

   • The device can provide a maximum continuous output current of up to 5A.
   • For optimal performance, keep the load within the recommended range.

4. Quiescent Current:

   • The quiescent current is typically around 10渭A when there is no load on the output.

5. Efficiency:

   • The typical efficiency of the device is around 90% at full load conditions.

6. Switching Frequency:

   • The switching frequency can be set between 300kHz and 600kHz depending on the application requirements.

7. Dropout Voltage:

   • The dropout voltage is typically between 1.2V and 1.8V at maximum load conditions.

8. Temperature Considerations:

   • Ensure the operating temperature is within the range of -40掳C to 85掳C.
   • Store the device in an environment where the temperature ranges from -65掳C to 150掳C.

9. Protection Features:

   • The device includes overcurrent, overvoltage, and thermal protection to ensure safe operation.

10. Mounting and Handling:

    • Follow standard handling and mounting procedures to avoid damage to the device.
    • Use appropriate PCB layout techniques to minimize noise and improve thermal performance.

(For reference only)