SN74S74N.

SN74S74N.


Specifications
SKU
12609006
Details

BUY SN74S74N. https://www.utsource.net/itm/p/12609006.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VCC 4.75 - 5.25 V Operating Range
Output High Voltage VOH - 2.4 3.4 V IOL = 0.4 mA, VCC = 5V
Output Low Voltage VOL 0.0 0.4 0.5 V IOL = 16 mA, VCC = 5V
Input High Voltage VIH 2.0 - - V
Input Low Voltage VIL - - 0.8 V
Propagation Delay Time tpd 12 - 22 ns VCC = 5V, TA = 25掳C
Set to Q High ts 20 - 35 ns VCC = 5V, TA = 25掳C
Reset to Q Low tr 20 - 35 ns VCC = 5V, TA = 25掳C
Minimum Pulse Width tpw(min) 20 - 35 ns VCC = 5V, TA = 25掳C
Maximum Clock Frequency fMAX - - 35 MHz VCC = 5V, TA = 25掳C
Power Dissipation Pd - - 100 mW Per Package
Operating Temperature TA -40 - 85 掳C Commercial Grade
Storage Temperature TSTG -65 - 150 掳C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.75V to 5.25V.
    • Connect the ground (GND) pin to a stable 0V reference.
  2. Input Signals:

    • Apply logic high (VIH) or low (VIL) signals to the set (S) and reset (R) inputs as required.
    • Ensure input signals meet the minimum and maximum voltage levels specified.
  3. Output Signals:

    • The Q and Q? outputs will reflect the state of the flip-flop based on the set and reset inputs.
    • Ensure the output loads do not exceed the current ratings for VOH and VOL.
  4. Timing:

    • Pay attention to the propagation delay time (tpd) to ensure proper timing in your circuit.
    • The minimum pulse width (tpw(min)) must be observed to avoid metastability issues.
  5. Temperature:

    • Operate the device within the specified temperature range to ensure reliable performance.
    • Store the device in the recommended storage temperature range to prevent damage.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
  7. Mounting:

    • Mount the device on a PCB with appropriate soldering techniques to ensure good electrical connections.
    • Ensure proper heat dissipation if operating at higher power levels or temperatures.
(For reference only)

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