Details
BUY 2SB795-AZ/JM https://www.utsource.net/itm/p/12609017.html
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Collector-Emitter Voltage | VCE | 300 | V |
| Emitter-Base Voltage | VEB | 5 | V |
| Collector Current | IC | 15 | A |
| Base Current | IB | 1.5 | A |
| Power Dissipation | PT | 120 | W |
| Operating Junction Temperature | TJ | -55 to +150 | 掳C |
| Storage Temperature | TS | -65 to +150 | 掳C |
| Transition Frequency | fT | 10 | MHz |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain operating junction temperature within specified limits.
- Use recommended mounting torque for screws to avoid damage to the transistor.
Biasing:
- Set the base current (IB) to ensure the transistor operates in the desired region (saturation, active, or cutoff).
- Avoid excessive base current which can lead to thermal runaway.
Power Dissipation:
- Monitor power dissipation to prevent overheating. Use a heatsink if necessary to keep the junction temperature below the maximum limit.
- Ensure adequate ventilation and cooling, especially in high-power applications.
Voltage Ratings:
- Do not exceed the maximum collector-emitter voltage (VCE) or emitter-base voltage (VEB).
- Protect the transistor from voltage spikes using clamping diodes or other protective circuits.
Storage:
- Store the transistor in a dry, cool environment to prevent moisture damage.
- Handle with care to avoid mechanical stress, which can affect performance.
Testing:
- Use appropriate test equipment and procedures to avoid damaging the transistor during testing.
- Follow safety guidelines to protect against electrical hazards.
Soldering:
- Preheat the transistor to reduce thermal shock during soldering.
- Use a low-temperature soldering iron and complete the soldering process quickly to minimize heat exposure.
Handling:
- Use static-protective equipment to prevent damage from electrostatic discharge (ESD).
- Handle the transistor by the body, not the leads, to avoid mechanical stress.
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