BC807-40,215 SOT-23

BC807-40,215 SOT-23


Specifications
SKU
12609046
Details

BUY BC807-40,215 SOT-23 https://www.utsource.net/itm/p/12609046.html

Parameter Symbol Min Typical Max Unit Condition
Collector-Emitter Voltage VCEO - - 45 V IC = 150 mA, TA = 25掳C
Emitter-Base Voltage VEBO - - 5 V IEBO = 5 mA, TA = 25掳C
Collector-Base Voltage VCBO - - 45 V ICBO = 1 渭A, TA = 25掳C
Continuous Collector Current IC - - 150 mA TA = 25掳C
Total Device Dissipation PT - - 350 mW TA = 25掳C
Junction Temperature TJ - - 150 掳C -
Storage Temperature Range TSTG -55 - 150 掳C -
Forward Current Transfer Ratio (hFE) hFE 100 300 - - IC = 2 mA, VCE = 5 V, TA = 25掳C
Base-Emitter Saturation Voltage VBE(sat) - 0.7 1.2 V IC = 150 mA, IB = 15 mA, TA = 25掳C
Collector-Emitter Saturation Voltage VCE(sat) - 0.2 0.3 V IC = 150 mA, IB = 15 mA, TA = 25掳C
Transition Frequency fT - 150 - MHz IC = 10 mA, VCE = 5 V, TA = 25掳C

Instructions for Using BC807-40,215 SOT-23:

  1. Handling and Storage:

    • Handle with care to avoid damage to the leads and body.
    • Store in a dry, cool place to prevent moisture damage.
  2. Mounting:

    • Use appropriate soldering techniques to avoid overheating.
    • Ensure proper alignment of the component on the PCB.
    • Soldering temperature should not exceed 260掳C for more than 10 seconds.
  3. Electrical Connections:

    • Connect the collector (C), base (B), and emitter (E) terminals correctly.
    • Ensure that the maximum ratings for voltage and current are not exceeded.
    • Use decoupling capacitors near the power supply lines to reduce noise.
  4. Thermal Management:

    • Ensure adequate heat dissipation if operating at high power levels.
    • Consider using a heatsink if the junction temperature is expected to approach the maximum rating.
  5. Testing:

    • Test the device under specified conditions to ensure it meets the required performance parameters.
    • Use a multimeter or oscilloscope to verify correct operation.
  6. Safety:

    • Follow all safety guidelines when handling and testing the device.
    • Avoid short circuits and overvoltage conditions to prevent damage.
  7. Compliance:

    • Ensure the device complies with relevant safety and regulatory standards for your application.
(For reference only)

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