Details

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Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	VIN	2.7	-	5.5	V
Output Voltage	VOUT	-	3.3	-	V
Output Current	IOUT	-	600	-	mA
Quiescent Current	IQ	-	1.2	-	渭A
Dropout Voltage	VDROPOUT	-	200	-	mV
Load Regulation	-	-	1.5	-	%
Line Regulation	-	-	0.5	-	%
PSRR (1 kHz)	-	-	70	-	dB
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-40	-	125	掳C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 2.7V to 5.5V.
   • Avoid exceeding the maximum input voltage to prevent damage to the device.

2. Output Voltage (VOUT):

   • The typical output voltage is 3.3V. No external components are required for this fixed output voltage.

3. Output Current (IOUT):

   • The device can provide up to 600mA of output current. Ensure that the load does not exceed this limit to avoid overheating or damage.

4. Quiescent Current (IQ):

   • The quiescent current is typically 1.2渭A, which is very low, making it suitable for battery-powered applications.

5. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 200mV. This means the input voltage should be at least 200mV higher than the output voltage to maintain regulation.

6. Load Regulation:

   • The load regulation is typically 1.5%, indicating the change in output voltage with varying load conditions.

7. Line Regulation:

   • The line regulation is typically 0.5%, indicating the change in output voltage with varying input voltage.

8. PSRR (Power Supply Rejection Ratio):

   • The PSRR at 1kHz is typically 70dB, which helps in filtering out noise from the input supply.

9. Operating Temperature (TOPR):

   • The device can operate within the temperature range of -40掳C to 85掳C. Ensure that the ambient temperature stays within these limits.

10. Storage Temperature (TSTG):

    • The device can be stored in temperatures ranging from -40掳C to 125掳C.

Additional Notes:

• Capacitors:
  • Use a 1渭F ceramic capacitor on the input side and a 1渭F ceramic capacitor on the output side for stability and noise reduction.
• PCB Layout:
  • Place the input and output capacitors as close as possible to the device to minimize parasitic inductance and improve performance.
• Thermal Considerations:
  • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.

(For reference only)