2SK641

2SK641


Specifications
Details

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Parameter Symbol Conditions Min Typ. Max Unit
Drain-source on-state resistance Rds(on) Vgs = 10V, Id = 5A - 0.03 -
Gate-source threshold voltage Vgs(th) Id = 1mA 2.0 2.5 3.0 V
Input capacitance Ciss Vds = 25V, f = 1MHz - 800 - pF
Output capacitance Coss Vds = 25V, f = 1MHz - 170 - pF
Reverse transfer capacitance Crss Vds = 25V, f = 1MHz - 60 - pF
Maximum drain current Id(max) Tc = 25掳C - - 10 A
Maximum gate-source voltage Vgs(max) Continuous - - 卤20 V
Maximum drain-source voltage Vds(max) Continuous - - 200 V
Total power dissipation Ptot Tc = 25掳C - - 20 W
Junction temperature Tj Operating range -55 - 150 掳C

Instructions for Use:

  1. Handling Precautions:

    • The 2SK641 is sensitive to electrostatic discharge (ESD). Handle with care and use appropriate ESD protection measures.
  2. Biasing:

    • Ensure that the gate-source voltage (Vgs) does not exceed the maximum rating of 卤20V to prevent damage.
    • Operate within the specified gate-source threshold voltage range to ensure reliable switching.
  3. Heat Dissipation:

    • Given the maximum junction temperature of 150掳C, ensure adequate heat sinking if operating at high currents or in high ambient temperatures.
  4. Capacitance Considerations:

    • Account for input, output, and reverse transfer capacitances in high-frequency applications to avoid instability or performance issues.
  5. Current Limitation:

    • Do not exceed the maximum drain current (Id(max)) of 10A at 25掳C case temperature to prevent overheating and potential device failure.
  6. Power Dissipation:

    • Monitor total power dissipation to stay within the 20W limit at 25掳C case temperature. Adjust derating factors as necessary for higher temperatures.
  7. Storage and Operation Temperature:

    • Store and operate the device within the specified temperature range (-55掳C to 150掳C) to maintain reliability and performance.
(For reference only)

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