AZ1117CH2-3.3TRG1

AZ1117CH2-3.3TRG1


Specifications
Details

BUY AZ1117CH2-3.3TRG1 https://www.utsource.net/itm/p/12609239.html

Parameter Symbol Conditions Min Typ Max Unit
Input Voltage VIN Continuous 2.5 - 14 V
Output Voltage VOUT Fixed - 3.3 - V
Output Current IOUT Continuous - 1.0 - A
Quiescent Current IQ VIN=5V, VOUT=3.3V - 5 - mA
Dropout Voltage VD IOUT=500mA - 1.0 - V
Power Dissipation PD TA=25掳C - 1.6 - W
Operating Junction Temp TJ Continuous -40 - 125 掳C
Storage Temperature TSTG -65 - 150 掳C

Instructions for AZ1117CH2-3.3TRG1

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.5V to 14V. Exceeding this range can damage the regulator.
  2. Output Voltage (VOUT):

    • The output voltage is fixed at 3.3V. No external components are required to set this voltage.
  3. Output Current (IOUT):

    • The regulator can supply up to 1.0A continuously. Ensure that the load does not exceed this current limit to avoid overheating or damage.
  4. Quiescent Current (IQ):

    • The quiescent current is approximately 5mA at an input voltage of 5V and an output voltage of 3.3V. This value helps in calculating the efficiency and power consumption.
  5. Dropout Voltage (VD):

    • At a load current of 500mA, the dropout voltage is typically around 1.0V. Keep this in mind when selecting the input voltage to ensure proper regulation.
  6. Power Dissipation (PD):

    • The maximum power dissipation at an ambient temperature of 25掳C is 1.6W. Adequate heat sinking may be necessary for applications where the regulator dissipates significant power.
  7. Operating Junction Temperature (TJ):

    • The device can operate within a junction temperature range of -40掳C to +125掳C. Monitor the temperature to prevent thermal shutdown or damage.
  8. Storage Temperature (TSTG):

    • Store the device in environments with temperatures ranging from -65掳C to +150掳C to maintain its reliability.

Ensure all connections are secure and follow good engineering practices for PCB layout, especially concerning bypass capacitors and thermal considerations.

(For reference only)

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