Details

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BUY TIC116M https://www.utsource.net/itm/p/12609294.html

Parameter	Symbol	Min	Typical	Max	Unit	Condition
Forward Voltage	VF	-	1.2	1.5	V	IF = 5 A, Tj = 25掳C
Peak Forward Current	IF(s)	-	-	50	A	t = 10 ms, IF = 10 A, Tj = 25掳C
Continuous Forward Current	IF	-	-	10	A	TC = 40掳C
Reverse Voltage	VRRM	-	-	600	V	Tj = 25掳C
Reverse Leakage Current	IR	-	50	100	渭A	VRRM = 600 V, Tj = 25掳C
Junction Temperature	Tj	-25	-	125	掳C	-
Storage Temperature	Tstg	-65	-	150	掳C	-

Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Use recommended mounting torque for screws to avoid mechanical stress.

2. Operational Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Ensure adequate cooling for continuous operation at high currents.

3. Handling:

   • Handle with care to avoid damage to the device.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

4. Testing:

   • Use appropriate test equipment and procedures to verify performance parameters.
   • Refer to the datasheet for detailed testing methods and conditions.

5. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Avoid exposure to corrosive environments.

6. Soldering:

   • Use a controlled soldering process to avoid thermal shock.
   • Soldering temperature should not exceed 260掳C for more than 10 seconds.

7. Circuit Design:

   • Include necessary protection circuits such as snubbers to handle voltage transients.
   • Ensure proper PCB layout to minimize parasitic inductance and capacitance.

8. Compliance:

   • Verify that the application complies with relevant safety and regulatory standards.

(For reference only)