Details
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| Parameter | Symbol | Min | Typical | Max | Unit | Condition |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 55 | - | V | - |
| Gate-Source Voltage | VGS | -15 | - | 15 | V | - |
| Continuous Drain Current | ID | - | 80 | - | A | TC = 25掳C |
| Continuous Drain Current | ID | - | 57 | - | A | TC = 75掳C |
| Continuous Drain Current | ID | - | 34 | - | A | TC = 100掳C |
| Pulse Drain Current | IDM | - | 160 | - | A | tpw = 10 渭s |
| Total Power Dissipation | PTOT | - | 150 | - | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | - |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C | - |
| Gate Charge | QG | - | 60 | - | nC | VDS = 55V, VGS = 10V, ID = 80A |
| Input Capacitance | Ciss | - | 3000 | - | pF | VDS = 55V, f = 1 MHz |
| Output Capacitance | Coss | - | 400 | - | pF | VDS = 55V, f = 1 MHz |
| Reverse Transfer Capacitance | Crss | - | 600 | - | pF | VDS = 55V, f = 1 MHz |
| On-State Resistance | RDS(on) | - | 0.06 | - | 惟 | VGS = 10V, ID = 80A, TJ = 25掳C |
| On-State Resistance | RDS(on) | - | 0.09 | - | 惟 | VGS = 10V, ID = 80A, TJ = 125掳C |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage.
- Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.
Mounting:
- Ensure that the device is securely mounted to a heatsink if operating at high power levels.
- Use thermal paste or thermal interface materials to improve heat transfer between the device and the heatsink.
Operating Conditions:
- Do not exceed the maximum ratings specified in the table.
- Ensure that the junction temperature does not exceed 175掳C to avoid thermal runaway and potential failure.
Gate Drive:
- Apply a gate-source voltage (VGS) within the specified range to turn the device on and off.
- Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
Thermal Management:
- Monitor the temperature of the device during operation to ensure it remains within safe limits.
- Consider forced air cooling or liquid cooling for high-power applications.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Keep the device in its original packaging until ready for use to protect against moisture and static discharge.
Testing:
- Perform initial testing at low power levels to verify correct operation before moving to higher power applications.
- Use appropriate test equipment to measure parameters such as VDS, ID, and RDS(on).
Compliance:
- Ensure that the device complies with all relevant safety and regulatory standards for your application.
- Refer to the datasheet for additional information and specific application notes.
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