STP80NF55L-06

STP80NF55L-06


Specifications
SKU
12609329
Details

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Parameter Symbol Min Typical Max Unit Condition
Drain-Source Voltage VDS - 55 - V -
Gate-Source Voltage VGS -15 - 15 V -
Continuous Drain Current ID - 80 - A TC = 25掳C
Continuous Drain Current ID - 57 - A TC = 75掳C
Continuous Drain Current ID - 34 - A TC = 100掳C
Pulse Drain Current IDM - 160 - A tpw = 10 渭s
Total Power Dissipation PTOT - 150 - W TC = 25掳C
Junction Temperature TJ - - 175 掳C -
Storage Temperature Range TSTG -55 - 150 掳C -
Gate Charge QG - 60 - nC VDS = 55V, VGS = 10V, ID = 80A
Input Capacitance Ciss - 3000 - pF VDS = 55V, f = 1 MHz
Output Capacitance Coss - 400 - pF VDS = 55V, f = 1 MHz
Reverse Transfer Capacitance Crss - 600 - pF VDS = 55V, f = 1 MHz
On-State Resistance RDS(on) - 0.06 - VGS = 10V, ID = 80A, TJ = 25掳C
On-State Resistance RDS(on) - 0.09 - VGS = 10V, ID = 80A, TJ = 125掳C

Instructions for Use:

  1. Handling Precautions:

    • Handle the device with care to avoid damage.
    • Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.
  2. Mounting:

    • Ensure that the device is securely mounted to a heatsink if operating at high power levels.
    • Use thermal paste or thermal interface materials to improve heat transfer between the device and the heatsink.
  3. Operating Conditions:

    • Do not exceed the maximum ratings specified in the table.
    • Ensure that the junction temperature does not exceed 175掳C to avoid thermal runaway and potential failure.
  4. Gate Drive:

    • Apply a gate-source voltage (VGS) within the specified range to turn the device on and off.
    • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
  5. Thermal Management:

    • Monitor the temperature of the device during operation to ensure it remains within safe limits.
    • Consider forced air cooling or liquid cooling for high-power applications.
  6. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Keep the device in its original packaging until ready for use to protect against moisture and static discharge.
  7. Testing:

    • Perform initial testing at low power levels to verify correct operation before moving to higher power applications.
    • Use appropriate test equipment to measure parameters such as VDS, ID, and RDS(on).
  8. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.
    • Refer to the datasheet for additional information and specific application notes.
(For reference only)

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