Details

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BUY 74ABT377N https://www.utsource.net/itm/p/12609353.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	1.65	-	3.6	V
Input Voltage (High Level)	VIH	2.0	-	VCC	V
Input Voltage (Low Level)	VIL	0	-	0.8	V
Output Voltage (High Level)	VOH	2.4	-	VCC - 0.1	V
Output Voltage (Low Level)	VOL	0	-	0.4	V
Input Current (High Level)	IIH	-1	-	20	渭A
Input Current (Low Level)	IIL	-20	-	1	渭A
Output Current (High Level)	IOH	-	-25	-	mA
Output Current (Low Level)	IOL	-	25	-	mA
Propagation Delay Time	tpd	-	3.5	7.0	ns	@ VCC = 3.3V, TA = 25掳C
Power Dissipation	PD	-	-	100	mW	Per package
Operating Temperature Range	TA	-40	-	85	掳C
Storage Temperature Range	TSTG	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (V_CC) is within the range of 1.65V to 3.6V.
   • Do not exceed the maximum supply voltage to avoid damaging the device.

2. Input Levels:

   • For a high input level (V_IH), ensure the voltage is at least 2.0V.
   • For a low input level (V_IL), ensure the voltage does not exceed 0.8V.

3. Output Levels:

   • The output high level (V_OH) should be at least 2.4V and can go up to V_CC - 0.1V.
   • The output low level (V_OL) should not exceed 0.4V.

4. Current Ratings:

   • The input current (I_IH and I_IL) should be within the specified limits to avoid damage.
   • The output current (I_OH and I_OL) should not exceed 卤25mA to prevent overheating or damage.

5. Propagation Delay:

   • The propagation delay time (t_pd) is typically 3.5ns at 3.3V and 25掳C, but can vary between 3.5ns and 7.0ns.

6. Power Dissipation:

   • The maximum power dissipation per package is 100mW. Ensure proper heat dissipation if operating near this limit.

7. Temperature Ranges:

   • The operating temperature range (T_A) is from -40掳C to 85掳C.
   • The storage temperature range (T_STG) is from -65掳C to 150掳C.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow ESD (Electrostatic Discharge) precautions when handling the device.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress and poor electrical connections.

10. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.

(For reference only)