Details

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BUY YG865C10 https://www.utsource.net/itm/p/12609370.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	Vin	4.5	-	28	V	Operating input voltage range
Output Voltage	Vout	-	5	-	V	Fixed output voltage (adjustable versions available)
Output Current	Iout	-	3	5	A	Maximum continuous output current
Efficiency	畏	-	92	-	%	Typical efficiency at nominal conditions
Quiescent Current	Iq	-	50	-	渭A	Quiescent current at no load
Dropout Voltage	Vdo	-	1.2	-	V	Dropout voltage at maximum load
Ripple Voltage	Vrip	-	30	-	mVpp	Output ripple voltage at full load
Operating Temp.	Toper	-40	-	85	掳C	Operating temperature range
Storage Temp.	Tstg	-40	-	125	掳C	Storage temperature range

Instructions for Use

1. Input Connection:

   • Connect the input voltage to the VIN pin.
   • Ensure the input voltage is within the specified range (4.5V to 28V).

2. Output Connection:

   • Connect the output load to the VOUT pin.
   • The output voltage is fixed at 5V. For adjustable versions, use the feedback resistor network to set the desired output voltage.

3. Ground Connection:

   • Connect the ground (GND) pin to the common ground of the system.

4. Capacitors:

   • Place a 10渭F electrolytic capacitor between VIN and GND close to the IC to stabilize the input.
   • Place a 10渭F electrolytic capacitor between VOUT and GND close to the IC to filter the output.

5. Thermal Considerations:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
   • Use a heatsink if necessary to maintain the junction temperature within the operating limits.

6. PCB Layout:

   • Keep the PCB traces short and wide to minimize inductance and resistance.
   • Use a ground plane to improve thermal performance and reduce noise.

7. Overcurrent Protection:

   • The IC has built-in overcurrent protection. If the output current exceeds the safe limit, the IC will shut down to prevent damage.

8. Short-Circuit Protection:

   • The IC is protected against short circuits. It will automatically recover once the fault condition is removed.

9. Storage:

   • Store the IC in a dry environment to prevent moisture damage.
   • Follow ESD (Electrostatic Discharge) precautions when handling the IC.

10. Testing:

    • Before final assembly, test the circuit with a known good load to ensure proper operation.
    • Verify the output voltage and current under various load conditions.

(For reference only)