Details

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BUY PALCE16V8Q-25 https://www.utsource.net/itm/p/12609376.html

Parameter	Description	Value
Device Type	Programmable Array Logic with CMOS EEPROM Technology	PALCE16V8Q-25
Package	Plastic Quad Flat Pack (PQFP)	20-Pin
Operating Voltage (Vcc)	Supply Voltage Range	4.5V to 5.5V
Maximum Clock Frequency (fMAX)	Maximum Operating Frequency	25 MHz
Input Voltage (VIH)	High-Level Input Voltage	2.0V to Vcc
Input Voltage (VIL)	Low-Level Input Voltage	0V to 0.8V
Output Voltage (VOH)	High-Level Output Voltage	Vcc - 0.4V
Output Voltage (VOL)	Low-Level Output Voltage	0.4V
Output Current (IOH)	High-Level Output Current	-10 mA
Output Current (IOL)	Low-Level Output Current	10 mA
Power Dissipation (PD)	Total Power Dissipation	500 mW
Operating Temperature Range (Toper)	Commercial Grade	0掳C to 70掳C
Industrial Grade	-40掳C to 85掳C
Storage Temperature Range (Tstg)	Storage Temperature	-65掳C to 150掳C
Programming Voltage (Vpp)	Programming Voltage	12.6V 卤 0.6V
Programming Time	Typical Programming Time	1 ms per location
Erase Time	Typical Erase Time	10 ms
Endurance	Programming/Erase Cycles	10,000 cycles
Data Retention	Data Retention Time	10 years at 85掳C

Instructions for Use

1. Power Supply:

   • Connect the Vcc pin to a stable 5V power supply.
   • Connect the GND pin to the ground.

2. Programming:

   • Use a compatible programmer to program the device.
   • Apply the programming voltage (Vpp) to the appropriate pin.
   • Follow the programming algorithm provided by the manufacturer.

3. Erase:

   • Use the erase function of the programmer to erase the device before reprogramming.
   • Ensure the erase time is sufficient to fully reset the device.

4. Input/Output Handling:

   • Ensure input voltages are within the specified VIH and VIL ranges.
   • Do not exceed the maximum output current ratings.

5. Temperature Considerations:

   • Operate the device within the specified temperature range to ensure reliable performance.
   • Store the device in a dry environment within the storage temperature range.

6. Handling Precautions:

   • Handle the device with care to avoid static damage.
   • Use proper ESD protection when handling the device.

7. Mounting:

   • Solder the device using recommended soldering profiles to avoid thermal stress.
   • Ensure proper alignment and orientation during mounting.

8. Testing:

   • After programming and mounting, test the device to ensure it meets the expected functionality and performance criteria.

(For reference only)