Details

---

BUY IM6402AIJL https://www.utsource.net/itm/p/12609436.html

Parameter	Description	Value
Part Number	Full Part Number	IM6402AIJL
Type	Device Type	Integrated Circuit (IC)
Function	Primary Function	2-Channel High-Side Switch
Supply Voltage (Vcc)	Operating Supply Voltage Range	4.5V to 28V
Maximum Current (Iout)	Maximum Output Current per Channel	3A
Operating Temperature (Toper)	Operating Temperature Range	-40掳C to 125掳C
Package	Package Type	SOIC-8
Pin Count	Number of Pins	8
Quiescent Current (Iq)	Quiescent Current	100渭A (Typical)
Input Voltage (Vin)	Input Control Voltage Range	1.8V to 5.5V
Protection Features	Built-in Protection	Overcurrent, Overtemperature, and Short-Circuit Protection
ESD Rating	Electrostatic Discharge Tolerance	卤2kV (Human Body Model)
RoHS Compliance	RoHS Compliant	Yes
Lead Finish	Lead Finish	Matte Tin

Instructions for Use

1. Power Supply Connection:

   • Connect the supply voltage (Vcc) to Pin 8.
   • Ground (GND) should be connected to Pin 4.

2. Input Control:

   • Apply the input control signals to Pins 1 and 2 for controlling the high-side switches.
   • The input voltage range is 1.8V to 5.5V. A logic high will turn on the respective channel, while a logic low will turn it off.

3. Load Connection:

   • Connect the load between the output pins (Pins 5 and 7) and ground.
   • Ensure that the load current does not exceed 3A per channel.

4. Thermal Management:

   • Ensure adequate heat dissipation if operating at high currents or in high ambient temperatures.
   • Consider using a heatsink if necessary.

5. Protection:

   • The device has built-in overcurrent, overtemperature, and short-circuit protection. However, avoid prolonged operation under fault conditions to prevent damage.

6. Handling:

   • Handle the IC with care to avoid damage from electrostatic discharge (ESD).
   • Use appropriate ESD protection measures during handling and installation.

7. Storage:

   • Store the IC in a dry, cool place away from direct sunlight and sources of heat.

8. Soldering:

   • Follow standard soldering practices for surface mount devices (SMD).
   • Use a temperature-controlled soldering iron and avoid excessive heat application.

9. Testing:

   • After assembly, verify the correct operation of the IC by applying the specified input voltages and measuring the output current and voltage.

For detailed specifications and further information, refer to the datasheet provided by the manufacturer.

(For reference only)