Details

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BUY S0810NH https://www.utsource.net/itm/p/12609473.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	V_IN	2.7	-	5.5	V
Output Voltage	V_OUT	-	3.3	-	V	Fixed
Output Current	I_OUT	-	1	1.1	A
Quiescent Current	I_Q	-	20	40	渭A
Dropout Voltage	V_DO	-	200	300	mV	@ 1A
Power Dissipation	P_D	-	-	1.6	W
Operating Temperature	T_OP	-40	-	85	掳C
Storage Temperature	T_STG	-40	-	150	掳C
Thermal Resistance	胃_JA	-	50	-	掳C/W

Instructions for Using the S0810NH:

1. Input Voltage (V_IN):

   • Ensure the input voltage is within the range of 2.7V to 5.5V.
   • The device will not function properly if the input voltage is outside this range.

2. Output Voltage (V_OUT):

   • The output voltage is fixed at 3.3V.
   • No external components are required to set the output voltage.

3. Output Current (I_OUT):

   • The device can provide up to 1.1A of output current, with a typical output current of 1A.
   • Ensure that the load does not exceed the maximum output current to avoid overheating or damage.

4. Quiescent Current (I_Q):

   • The quiescent current is typically 20渭A and can go up to 40渭A.
   • This current is drawn by the device even when there is no load.

5. Dropout Voltage (V_DO):

   • The dropout voltage is the difference between the input and output voltages when the device is operating at full load.
   • At 1A output current, the dropout voltage is typically 200mV and can go up to 300mV.

6. Power Dissipation (P_D):

   • The maximum power dissipation is 1.6W.
   • Ensure adequate heat sinking if the device is expected to dissipate significant power.

7. Operating Temperature (T_OP):

   • The device can operate in temperatures ranging from -40掳C to 85掳C.
   • Avoid operating the device outside this temperature range to prevent performance degradation or damage.

8. Storage Temperature (T_STG):

   • The device can be stored in temperatures ranging from -40掳C to 150掳C.
   • Ensure that the device is not exposed to extreme temperatures for extended periods.

9. Thermal Resistance (胃_JA):

   • The thermal resistance from junction to ambient is typically 50掳C/W.
   • Use a heatsink if the device is expected to operate under high power conditions to maintain a safe junction temperature.

10. Mounting and Handling:

    • Handle the device with care to avoid mechanical damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

11. PCB Layout:

    • Ensure proper PCB layout to minimize noise and improve thermal performance.
    • Place the device close to the load to reduce trace resistance and inductance.

By following these guidelines, you can ensure optimal performance and reliability of the S0810NH low-dropout linear regulator.

(For reference only)