Details

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BUY 1458 https://www.utsource.net/itm/p/12609532.html

Parameter	Description
Device Type	Dual Operational Amplifier
Package	8-Pin DIP (Dual In-line Package)
Supply Voltage	卤2V to 卤18V (Single Supply: 4V to 36V)
Input Offset Voltage	7mV (Max) at 25掳C
Input Bias Current	50nA (Max) at 25掳C
Input Impedance	2M惟 (Min)
Slew Rate	0.5V/渭s (Typical)
Bandwidth	1MHz (Typical)
Output Swing	卤13V (Typical) at 卤15V supply
Quiescent Current	450渭A per amplifier (Max) at 25掳C
Operating Temperature	-40掳C to +85掳C
Storage Temperature	-65掳C to +150掳C

Instructions for Use

1. Power Supply Connection:

   • Connect the positive supply voltage to pin 8.
   • Connect the negative supply voltage to pin 4.
   • For single supply operation, connect pin 4 to ground and pin 8 to the positive supply.

2. Input Connection:

   • Connect the non-inverting input (pin 3 for the first op-amp, pin 5 for the second op-amp) to the signal source.
   • Connect the inverting input (pin 2 for the first op-amp, pin 6 for the second op-amp) to the feedback network or reference voltage.

3. Output Connection:

   • The output of the first op-amp is on pin 1.
   • The output of the second op-amp is on pin 7.
   • Connect the output to the load or next stage of the circuit.

4. Feedback Network:

   • For inverting configuration, connect a resistor from the output to the inverting input and another resistor from the inverting input to the signal source.
   • For non-inverting configuration, connect a resistor from the output to the inverting input and another resistor from the inverting input to ground.

5. Decoupling Capacitors:

   • Place a 0.1渭F ceramic capacitor between the power supply pins and ground close to the IC to reduce noise and improve stability.

6. Temperature Considerations:

   • Ensure the operating temperature is within the specified range to avoid damage or performance degradation.
   • For extended temperature ranges, refer to the datasheet for specific guidelines.

7. Storage:

   • Store the IC in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge, which can damage the device.

8. Testing:

   • Before finalizing the design, test the circuit under various conditions to ensure it meets the required specifications.

9. Safety:

   • Always follow proper safety procedures when handling electronic components.
   • Avoid exceeding the maximum ratings to prevent damage to the device.

(For reference only)