Details
BUY 74F784PC https://www.utsource.net/itm/p/12609538.html
| Parameter | Description | Value |
|---|---|---|
| Part Number | Identification of the component | 74F784PC |
| Function | Description of the function | Quad 2-Input NAND Gate |
| Package Type | Type of package | Plastic Small Outline Package (SOIC) |
| Number of Pins | Total number of pins | 14 |
| Supply Voltage (Vcc) | Operating voltage range | 4.5V to 5.5V |
| Propagation Delay | Time delay for signal propagation | 3.6 ns (typical at Vcc=5V) |
| Power Dissipation | Maximum power dissipation | 100 mW |
| Operating Temperature | Temperature range for operation | -40掳C to +85掳C |
| Storage Temperature | Temperature range for storage | -65掳C to +150掳C |
| Input Current (IIH) | Input current at high level | 卤1 渭A (max) |
| Input Current (IIL) | Input current at low level | 卤1 渭A (max) |
| Output Current (IOH) | Output current at high level | -4 mA (min) |
| Output Current (IOL) | Output current at low level | 16 mA (min) |
Instructions:
- Power Supply: Ensure that the supply voltage is within the specified range (4.5V to 5.5V). Connect Vcc to pin 14 and GND to pin 7.
- Signal Levels: Use standard TTL logic levels for inputs and outputs.
- Decoupling Capacitors: Place a 0.1渭F decoupling capacitor close to the power pins to minimize noise and transient effects.
- Unused Inputs: Tie all unused inputs to either Vcc or GND to avoid floating states which can lead to unpredictable behavior.
- Handling Precautions: Handle with care to prevent damage from electrostatic discharge (ESD). Follow proper ESD handling procedures.
- Mounting: Ensure proper mounting orientation and alignment during PCB assembly to avoid mechanical stress on the package.
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