Details
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| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | - | 5.5 | V |
| Input Low Voltage | VIL | - | 0.8 | - | V |
| Input High Voltage | VIH | - | 2.0 | - | V |
| Output Low Voltage | VOL | - | 0.4 | - | V |
| Output High Voltage | VOH | - | 3.6 | - | V |
| Propagation Delay Time | tpd | - | 3.5 | - | ns |
| Power Dissipation | PD | - | - | 100 | mW |
| Operating Temperature | TA | -40 | - | 85 | 掳C |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C |
Instructions for Use
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 5.5V.
- Connect the ground (GND) pin to a stable 0V reference.
Input Signals:
- Input signals should be within the specified input voltage levels (VIL and VIH).
- Avoid applying voltages outside the supply voltage range to the input pins.
Output Signals:
- The output signals will be within the specified output voltage levels (VOL and VOH).
- Ensure that the load connected to the output does not exceed the maximum power dissipation (PD).
Propagation Delay:
- The typical propagation delay time (tpd) is 3.5ns. This value can vary depending on the specific operating conditions.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40掳C to 85掳C).
- Store the device within the storage temperature range (-65掳C to 150掳C).
Handling and Storage:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Store the device in a dry environment to prevent moisture-related issues.
Mounting and Soldering:
- Follow recommended soldering profiles to ensure reliable connections.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing:
- Test the device under the specified operating conditions to ensure proper functionality.
- Use appropriate test equipment and methods to avoid damaging the device.
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