Details

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BUY TC74ACT299P https://www.utsource.net/itm/p/12609621.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	5.5	V
Input Voltage	VI	Input Low	0	-	0.8	V
Input Voltage	VI	Input High	2.0	-	VCC	V
Output Voltage	VO	Output Low	0	-	0.4	V
Output Voltage	VO	Output High	2.4	-	VCC - 0.1	V
Input Current	II	Input Low	-1	-	1	渭A
Input Current	II	Input High	-1	-	1	渭A
Output Current	IO	Output Low	-	-	8	mA
Output Current	IO	Output High	-	-	-8	mA
Propagation Delay	tpd	VCC = 5V, TA = 25掳C	6	-	-	ns
Power Dissipation	PD	Continuous	-	-	350	mW
Operating Temperature	TA	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • For input low, ensure the input voltage (V_I) is between 0V and 0.8V.
   • For input high, ensure the input voltage (V_I) is between 2.0V and V_CC.

3. Output Signals:

   • For output low, the output voltage (V_O) will be between 0V and 0.4V.
   • For output high, the output voltage (V_O) will be between 2.4V and V_CC - 0.1V.

4. Current Ratings:

   • The maximum input current (I_I) should not exceed 卤1渭A.
   • The maximum output current (I_O) should not exceed 卤8mA.

5. Propagation Delay:

   • At V_CC = 5V and ambient temperature (T_A) = 25掳C, the propagation delay (t_pd) is typically 6ns.

6. Thermal Considerations:

   • The device can operate at temperatures ranging from -40掳C to 85掳C.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

7. Power Dissipation:

   • The maximum power dissipation (P_D) is 350mW. Ensure proper heat sinking if operating near this limit.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow standard ESD precautions when handling and soldering the device.

(For reference only)