IXER35N120D1

IXER35N120D1


Specifications
Details

BUY IXER35N120D1 https://www.utsource.net/itm/p/12609662.html

Parameter Symbol Min Typ Max Unit Conditions
Collector-Emitter Voltage V CES - - 1200 V
Emitter-Collector Voltage V ECS - - 1200 V
Gate-Emitter Voltage V GES -15 - 15 V
Continuous Collector Current I C - 35 - A Tc = 25掳C
Pulse Collector Current I CM - 70 - A tp = 10 渭s, IGBT Turn-on
Power Dissipation Ptot - - 300 W Tc = 25掳C
Junction Temperature T J -55 - 150 掳C
Storage Temperature T STG -55 - 150 掳C

Instructions for Use:

  1. Handling Precautions: The IXER35N120D1 is sensitive to electrostatic discharge (ESD). Handle with care using appropriate ESD precautions.
  2. Mounting: Ensure proper heat sinking to maintain junction temperature within specified limits. Thermal interface materials can be used between the device and heat sink.
  3. Gate Drive Requirements: The gate requires a clean drive signal to avoid false triggering or excessive switching losses. Ensure the gate drive circuitry provides sufficient current to charge and discharge the gate capacitance quickly.
  4. Overcurrent Protection: Implement overcurrent protection mechanisms to safeguard against conditions that could exceed the maximum collector current ratings.
  5. Storage and Operation Temperature: Operate and store the device within the specified temperature ranges to ensure reliable performance and longevity.
  6. Soldering: Follow recommended soldering profiles to prevent thermal damage. Avoid exposing the device to temperatures exceeding its storage temperature limit during soldering operations.
(For reference only)

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