Details
BUY IXER35N120D1 https://www.utsource.net/itm/p/12609662.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | V CES | - | - | 1200 | V | |
| Emitter-Collector Voltage | V ECS | - | - | 1200 | V | |
| Gate-Emitter Voltage | V GES | -15 | - | 15 | V | |
| Continuous Collector Current | I C | - | 35 | - | A | Tc = 25掳C |
| Pulse Collector Current | I CM | - | 70 | - | A | tp = 10 渭s, IGBT Turn-on |
| Power Dissipation | Ptot | - | - | 300 | W | Tc = 25掳C |
| Junction Temperature | T J | -55 | - | 150 | 掳C | |
| Storage Temperature | T STG | -55 | - | 150 | 掳C |
Instructions for Use:
- Handling Precautions: The IXER35N120D1 is sensitive to electrostatic discharge (ESD). Handle with care using appropriate ESD precautions.
- Mounting: Ensure proper heat sinking to maintain junction temperature within specified limits. Thermal interface materials can be used between the device and heat sink.
- Gate Drive Requirements: The gate requires a clean drive signal to avoid false triggering or excessive switching losses. Ensure the gate drive circuitry provides sufficient current to charge and discharge the gate capacitance quickly.
- Overcurrent Protection: Implement overcurrent protection mechanisms to safeguard against conditions that could exceed the maximum collector current ratings.
- Storage and Operation Temperature: Operate and store the device within the specified temperature ranges to ensure reliable performance and longevity.
- Soldering: Follow recommended soldering profiles to prevent thermal damage. Avoid exposing the device to temperatures exceeding its storage temperature limit during soldering operations.
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