Details
BUY TPCA8125,L1Q https://www.utsource.net/itm/p/12609671.html
| Parameter | Description | Value |
|---|---|---|
| Part Number | Device Identifier | TPCA8125, L1Q |
| Type | Type of Component | Power MOSFET |
| Package | Package Type | TO-263 (D2PAK) |
| VDS (Max) | Maximum Drain-to-Source Voltage | 60V |
| RDS(on) @ VGS=10V | On-State Resistance at Gate-to-Source Voltage of 10V | 4.7 m惟 |
| ID (Max) | Maximum Drain Current | 75A |
| Power Dissipation | Maximum Power Dissipation (at Tc = 25掳C) | 235W |
| Operating Temperature Range | Operating Junction Temperature Range | -55掳C to 150掳C |
| Storage Temperature Range | Storage Temperature Range | -65掳C to 150掳C |
| Gate Charge | Total Gate Charge | 95 nC |
| Input Capacitance | Input Capacitance at VGS = 0V and f = 1 MHz | 1400 pF |
| Output Capacitance | Output Capacitance at VDS = 10V and f = 1 MHz | 180 pF |
Instructions for Use:
- Handling: Handle the device with care to avoid damage to the leads and body. Electrostatic discharge (ESD) sensitive; use proper ESD precautions.
- Mounting: Ensure that the mounting surface is flat and clean. Apply thermal compound if necessary to improve heat dissipation.
- Soldering: Preheat the PCB to reduce thermal shock. Use a soldering temperature not exceeding 260掳C for no more than 10 seconds per joint.
- Testing: Before installing into final applications, test the device parameters using standard test circuits to ensure it meets specifications.
- Storage: Store in original packaging in a dry, cool place away from direct sunlight and sources of heat.
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