Details

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BUY CY7C164-25PC https://www.utsource.net/itm/p/12609688.html

Parameter	Description	Value
Part Number	Device Identifier	CY7C164-25PC
Function	Type of Memory	2K x 8 CMOS Static RAM
Package	Physical Case	28-Pin Plastic CERDIP
Supply Voltage	Operating Voltage Range	4.5V to 5.5V
Access Time	Maximum Access Time	25 ns
Data Retention	Minimum Data Retention Time	20 years at 25掳C
Operating Temp.	Temperature Range for Operation	-40掳C to +85掳C
Storage Temp.	Temperature Range for Storage	-65掳C to +150掳C
Power Dissipation	Maximum Power Consumption	300 mW (Typical)
Standby Current	Quiescent Current in Standby Mode	2 渭A (Typical)
Active Current	Operating Current	15 mA (Typical)

Instructions:

1. Power Supply Connection: Connect VCC to a stable 5V power supply and GND to the system ground. Ensure proper decoupling capacitors are placed close to the power pins to minimize noise.

2. Signal Levels: All inputs must be driven to either VCC or GND levels to ensure reliable operation. Use pull-up or pull-down resistors if necessary.

3. Address Lines: The address lines (A0-A10) should be connected to the address bus of the system. Ensure that the address lines are stable before the falling edge of the Write Enable (WE) signal.

4. Data Lines: Connect data lines (D0-D7) to the data bus of the system. For write operations, ensure data is stable on the data lines before the falling edge of WE.

5. Control Signals:

   • Write Enable (WE): Active low. When low, data present on the data lines is written into the addressed location.
   • Output Enable (OE): Active low. When low, the contents of the addressed memory location appear on the data output lines.
   • Chip Select (CS): Active low. When high, all inputs except OE are ignored, placing the device in standby mode to reduce power consumption.

6. Timing Considerations: Ensure that the timing requirements for setup and hold times for address, data, and control signals are met. Refer to the datasheet for specific timing diagrams.

7. Handling Precautions: Handle the CY7C164-25PC with care to avoid ESD damage. Use appropriate anti-static measures when handling the component.

8. Mounting: Ensure that the package is mounted securely on the PCB with proper soldering techniques to avoid mechanical stress and ensure good electrical connections.

(For reference only)