Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 4.5 | 5.0 | 5.5 | V | |
| Output Current | Iout | Continuous | 1.0 | 1.2 | A | |
| Peak Output Current | Ipeak | Pulse | 2.0 | 2.5 | A | |
| Operating Temperature | Temp | Storage/Operating | -40 | 85 | 掳C | |
| Quiescent Current | Iq | No Load | 0.1 | 0.2 | 0.3 | mA |
| Thermal Resistance | Rth | Junction to Ambient | 50 | 掳C/W | ||
| Rise Time | Tr | 0V to 90% Vout | 10 | 20 | ns | |
| Fall Time | Tf | 90% Vout to 0V | 10 | 20 | ns | |
| Propagation Delay | Tpd | Input to Output | 15 | 25 | ns |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
- Use a stable power source to avoid fluctuations that could affect performance.
Output Current:
- The continuous output current (Iout) should not exceed 1.2A.
- For pulse applications, the peak output current (Ipeak) can reach up to 2.5A, but ensure the duty cycle is low to prevent overheating.
Temperature:
- The operating temperature range is from -40掳C to 85掳C.
- Store the device in the same temperature range to maintain reliability.
Quiescent Current:
- The quiescent current (Iq) is typically 0.2mA with no load. Ensure this is accounted for in your power budget.
Thermal Management:
- The thermal resistance (Rth) from junction to ambient is 50掳C/W. Use appropriate heat sinks or cooling methods if operating at high currents or in high-temperature environments.
Signal Timing:
- The rise time (Tr) and fall time (Tf) are both around 15ns under typical conditions, ensuring fast switching.
- The propagation delay (Tpd) is approximately 20ns, which is important for timing-sensitive applications.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store in a dry, cool place to prevent moisture damage.
Mounting:
- Follow the recommended PCB layout guidelines to ensure proper thermal dissipation and electrical performance.
- Use appropriate soldering techniques to avoid damage to the device during assembly.
Testing:
- Before finalizing the design, test the device under all expected operating conditions to ensure it meets performance requirements.
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