Details

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BUY MC14014B https://www.utsource.net/itm/p/12609750.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	3.0	5.0	18.0	V
Input Voltage (High)	VIH	-	2.0	3.5	VCC - 1.5	V
Input Voltage (Low)	VIL	-	0	0.8	1.5	V
Output Voltage (High)	VOH	IO = -1.0 mA	-	2.4	VCC - 0.5	V
Output Voltage (Low)	VOL	IO = 16 mA	-	0.1	0.5	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25掳C	-	12	30	ns
Power Dissipation	PD	-	-	-	100	mW
Operating Temperature Range	TA	-	-40	25	85	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 3.0V to 18.0V.
   • Connect the ground (GND) pin to a stable reference point.

2. Input Signals:

   • For a high input (V_IH), ensure the voltage is at least 2.0V and does not exceed V_CC - 1.5V.
   • For a low input (V_IL), ensure the voltage is below 1.5V.

3. Output Signals:

   • When the output is high (V_OH), it should be at least 2.4V when V_CC = 5V.
   • When the output is low (V_OL), it should be no more than 0.5V.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 12ns at V_CC = 5V and T_A = 25掳C. Ensure this delay is accounted for in your timing calculations.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 100mW. Ensure the device is not operated beyond this limit to avoid overheating.

6. Temperature Ranges:

   • The operating temperature range (T_A) is from -40掳C to 85掳C.
   • The storage temperature range (T_STG) is from -65掳C to 150掳C.

7. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
   • Ensure proper soldering techniques to avoid thermal stress on the device.

8. Testing:

   • Before integrating the device into a circuit, test it under the specified conditions to ensure it meets the required performance parameters.

(For reference only)