Details

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BUY TL074IN https://www.utsource.net/itm/p/12609772.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	3	-	18	V	Dual supply 卤1.5V to 卤9V, single supply 3V to 18V
Input Offset Voltage	VIO	-	2	10	mV	At 25掳C
Input Bias Current	IB	-	80	160	nA	At 25掳C
Input Offset Current	IOS	-	10	50	nA	At 25掳C
Input Voltage Range	VCM	0	-	VCC-1.5	V	Common-mode input voltage range
Output Voltage Swing	VOS	-	VCC-3	VCC-1.5	V	With 2k惟 load, at 25掳C
Slew Rate	SR	-	13	-	V/渭s	At 25掳C
Large Signal Voltage Gain	AV	-	4	-	MV/V	At 25掳C
Bandwidth (Unity Gain)	fT	-	3.5	-	MHz	At 25掳C
Power Consumption	PD	-	1.5	-	mW	Per amplifier, at 25掳C
Operating Temperature Range	TA	-40	-	85	掳C	Commercial grade
Storage Temperature Range	TSTG	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage: The TL074IN can operate with a dual supply ranging from 卤1.5V to 卤9V or a single supply from 3V to 18V. Ensure the supply voltage is within these limits to avoid damage.

2. Input Voltage Range: The common-mode input voltage should not exceed the range from 0V to V_CC - 1.5V. Exceeding this range can lead to incorrect operation or damage.

3. Output Voltage Swing: The output voltage swing is limited to V_CC - 3V to V_CC - 1.5V with a 2k惟 load. Ensure that the load resistance is appropriate to achieve the desired output swing.

4. Slew Rate: The slew rate of 13V/渭s limits the maximum rate of change of the output voltage. This is important for high-frequency applications to avoid distortion.

5. Operating Temperature: The device is designed to operate within a temperature range of -40掳C to 85掳C. Ensure that the operating environment does not exceed these limits.

6. Storage Temperature: The storage temperature range is -65掳C to 150掳C. Store the device in a dry, temperature-controlled environment to prevent damage.

7. Power Consumption: Each amplifier consumes approximately 1.5mW at 25掳C. Consider this when designing power supply circuits.

8. Handling: Handle the device with care to avoid static discharge, which can damage the internal components. Use proper ESD protection measures.

9. Mounting: Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.

10. Testing: After installation, test the device under typical operating conditions to ensure it meets the required performance specifications.

(For reference only)