BUZ325.

BUZ325.


Specifications
SKU
12609901
Details

BUY BUZ325. https://www.utsource.net/itm/p/12609901.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage Vcc 4.5 - 20 V Operating supply voltage range
Input High Voltage VIH 2.0 - Vcc V Minimum input voltage for logic high
Input Low Voltage VIL 0 - 0.8 V Maximum input voltage for logic low
Output High Voltage VOH - 4.5 Vcc V Output voltage when high
Output Low Voltage VOL 0 - 0.4 V Output voltage when low
Quiescent Current IQ - 1 5 渭A Current consumption at no load
Output Current (Sink) IOS - 50 100 mA Maximum output current when sinking
Output Current (Source) IOSR - 5 10 mA Maximum output current when sourcing
Propagation Delay Time tpd 2 5 10 ns Time delay from input to output
Storage Temperature Tstg -65 - 150 掳C Temperature range for storage
Operating Temperature Topr -40 - 85 掳C Temperature range for operation

Instructions for Using the BUZ325:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 20V.
    • Connect the Vcc pin to the positive supply and GND pin to the ground.
  2. Input Signals:

    • For logic high, ensure the input voltage (VIH) is at least 2.0V or up to Vcc.
    • For logic low, ensure the input voltage (VIL) is between 0V and 0.8V.
  3. Output Signals:

    • The output will be high (VOH) when the input is high, typically close to Vcc.
    • The output will be low (VOL) when the input is low, typically close to 0V.
  4. Current Handling:

    • The device can sink up to 100mA and source up to 10mA.
    • Ensure the load connected to the output does not exceed these limits.
  5. Timing Considerations:

    • The propagation delay time (tpd) is between 2ns and 10ns, depending on the operating conditions.
    • Account for this delay in your circuit design to avoid timing issues.
  6. Temperature Range:

    • Store the device in temperatures between -65掳C and 150掳C.
    • Operate the device in temperatures between -40掳C and 85掳C to ensure reliable performance.
  7. Handling and Installation:

    • Handle the device with care to avoid static damage.
    • Follow standard PCB assembly practices for soldering and mounting.
  8. Testing:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.

By following these guidelines, you can effectively use the BUZ325 in your electronic circuits.

(For reference only)

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