Details

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BUY TLC7226C https://www.utsource.net/itm/p/12609905.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	2.0	5.0	5.5	V
Output Current (Sink)	IO(SINK)	-	10	20	mA
Output Current (Source)	IO(SOURCE)	-	10	20	mA
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Input Leakage Current	II	-	1	5	渭A
Output Leakage Current	IOL	-	1	5	渭A
Propagation Delay Time	tPD	10	25	50	ns
Power Dissipation	PD	-	-	350	mW

Instructions for Use:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 2.0V to 5.5V. Operating outside this range can damage the device.

2. Output Current:

   • The device can sink or source up to 20mA per output. Ensure that the load does not exceed this current limit to avoid damage.

3. Operating Temperature:

   • The device is designed to operate within the temperature range of -40掳C to 85掳C. Exceeding these temperatures can affect performance and reliability.

4. Storage Temperature:

   • Store the device in an environment where the temperature ranges from -65掳C to 150掳C to ensure long-term stability.

5. Input Leakage Current:

   • The input leakage current is typically around 1渭A. Design your circuits to account for this small current to maintain accuracy.

6. Output Leakage Current:

   • The output leakage current is also around 1渭A. This should be considered when designing high-impedance circuits.

7. Propagation Delay Time:

   • The propagation delay time is typically 25ns but can vary between 10ns and 50ns. This is important for timing-critical applications.

8. Power Dissipation:

   • The maximum power dissipation is 350mW. Ensure adequate heat dissipation if the device is expected to operate near this limit.

9. Handling:

   • Handle the device with care to avoid static damage. Use proper ESD protection measures during handling and installation.

10. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management. Avoid placing the device near high-heat sources.

11. Testing:

    • Before deploying the device in a final application, test it under actual operating conditions to ensure it meets all performance specifications.

(For reference only)