Details

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BUY HKE74HCT166 https://www.utsource.net/itm/p/12609943.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage	2.0	-	5.5	V
Output High Voltage (VOH)	Voltage at output when high	-	-	VCC - 0.25	V
Output Low Voltage (VOL)	Voltage at output when low	0	-	0.25	V
Input High Voltage (VIH)	Minimum input voltage to register as high	2.0	-	5.5	V
Input Low Voltage (VIL)	Maximum input voltage to register as low	0.8	-	2.0	V
Propagation Delay Time (tpd)	Time delay from input change to output change	-	10	35	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	100	mW
Operating Temperature Range (Tamb)	Ambient temperature range for operation	-40	-	85	掳C
Storage Temperature Range (Tstg)	Temperature range for storage	-65	-	150	掳C

Instructions for Using HKE74HCT166

1. Supply Voltage:

   • Ensure the supply voltage (VCC) is within the range of 2.0V to 5.5V.
   • Connect VCC to the positive power supply and GND to the ground.

2. Output Voltage Levels:

   • When the output is high, the voltage should be close to VCC but not less than VCC - 0.25V.
   • When the output is low, the voltage should be no more than 0.25V.

3. Input Voltage Levels:

   • For an input to be recognized as high, it must be at least 2.0V.
   • For an input to be recognized as low, it must be no more than 0.8V.

4. Propagation Delay:

   • The propagation delay time (tpd) is typically 10ns and can be up to 35ns. This is the time it takes for the output to change after an input change.

5. Power Dissipation:

   • Ensure that the power dissipation does not exceed 100mW to avoid overheating and potential damage.

6. Operating Temperature:

   • The device can operate within an ambient temperature range of -40掳C to 85掳C.

7. Storage Temperature:

   • Store the device in an environment with a temperature range of -65掳C to 150掳C.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Use appropriate ESD protection when handling the device.

9. Soldering:

   • Follow recommended soldering profiles to ensure reliable connections without damaging the device.

10. Testing:

    • Test the device under typical operating conditions to ensure proper functionality before deploying in a final application.

(For reference only)