Details

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BUY HM6167LP-8 https://www.utsource.net/itm/p/12609949.html

Parameter	Description	Value
Part Number	Full Part Number	HM6167LP-8
Type	Device Type	Low Power SRAM
Capacity	Memory Capacity	64 K x 8 bits (512 Kbits)
Vcc Range	Operating Voltage	2.0V to 3.6V
Icc	Supply Current (Typical)	1.0 mA (Active), 1.0 渭A (Standby)
Access Time	Access Time (Typical)	70 ns
Data Retention	Data Retention Time	10 years at 85掳C
Operating Temperature	Operating Temperature Range	-40掳C to +85掳C
Package	Package Type	28-Pin SOP (Small Outline Package)
Pin Configuration	Pin Count	28 pins
Organization	Memory Organization	8K x 8 x 8 banks
Standby Mode	Standby Mode	Low Power Consumption Mode
Write Cycle	Write Cycle Time	70 ns
Endurance	Endurance	Unlimited Writes (No wear-out mechanism)
RoHS Compliance	RoHS Compliance	Yes
Lead Finish	Lead Finish	Tin/Lead (Sn/Pb) or Matte Tin (Sn)

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.0V to 3.6V.
   • Connect Vcc to the appropriate pin and GND to the ground pin.

2. Addressing:

   • The device has 16 address lines (A0-A15) to access the 64K memory locations.
   • Connect these lines to the corresponding address outputs from your microcontroller or other control logic.

3. Data Lines:

   • The device has 8 data lines (D0-D7) for data input and output.
   • Connect these lines to the data bus of your system.

4. Control Signals:

   • Chip Select (CS#): Active low. When CS# is low, the device is selected.
   • Output Enable (OE#): Active low. When OE# is low, the data outputs are enabled.
   • Write Enable (WE#): Active low. When WE# is low, a write operation is performed.
   • Write Protect (WP#): Active low. When WP# is low, write operations are inhibited.

5. Standby Mode:

   • To enter standby mode, set CS# high. This reduces power consumption to the typical standby current.

6. Timing Considerations:

   • Ensure that the access time (70 ns) is respected during read and write operations.
   • The write cycle time should also be observed to avoid data corruption.

7. Handling:

   • Handle the device with care to avoid static damage. Use proper ESD protection measures.
   • Follow the recommended soldering profile for the 28-Pin SOP package to ensure reliable connections.

8. Storage:

   • Store the device in a dry, cool place to maintain its performance and reliability.

9. Testing:

   • After installation, perform a thorough test to verify the functionality of the device, including read and write operations across the entire memory range.

(For reference only)