Details
BUY RUR040N02TL https://www.utsource.net/itm/p/12609984.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 200 | V | Maximum drain-source voltage | ||
| Gate-Source Voltage | VGS | -15 | 15 | V | Maximum gate-source voltage | |
| Continuous Drain Current | ID | 4.0 | A | Continuous drain current at TC = 25掳C | ||
| Pulse Drain Current | IDM | 8.6 | A | Pulse drain current (t = 10 渭s, duty cycle = 1%) | ||
| Power Dissipation | PD | 1.2 | W | Total power dissipation at TC = 25掳C | ||
| Junction Temperature | TJ | -55 | 150 | 掳C | Operating junction temperature range | |
| Storage Temperature | TSTG | -55 | 150 | 掳C | Storage temperature range |
Instructions for Use:
Handling Precautions:
- Avoid exposing the device to excessive mechanical stress or moisture.
- Handle with care to prevent damage to the leads and body.
Mounting:
- Ensure proper alignment of the device during mounting to avoid misalignment issues.
- Follow manufacturer guidelines for soldering profiles to prevent thermal shock.
Electrical Connections:
- Verify that all connections are secure and correctly wired according to the circuit diagram.
- Ensure that the gate-source voltage does not exceed the maximum rating to prevent damage.
Thermal Management:
- Adequate heat sinking is required if operating near the maximum continuous drain current.
- Monitor the junction temperature to ensure it remains within the specified operating range.
Storage:
- Store in a dry, cool environment away from direct sunlight and corrosive substances.
- Observe anti-static precautions when handling to protect against ESD damage.
Testing:
- Perform initial testing under controlled conditions to validate performance parameters.
- Regularly inspect the device for signs of wear or damage during operation.
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