Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | Operating | 4.75 | 5 | 5.25 | V |
| Output Current | Iout | Continuous | - | 100 | - | mA |
| Quiescent Current | Iq | Vcc = 5V | - | 10 | - | 渭A |
| Thermal Resistance | 胃ja | Junction to Air | - | 120 | - | 掳C/W |
| Operating Temperature | Topr | Storage | -40 | - | 85 | 掳C |
| Storage Temperature | Tstg | Storage | -65 | - | 150 | 掳C |
| Maximum Junction Temp. | Tjmax | - | - | 150 | 掳C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 4.75V to 5.25V.
- Use a stable power source to avoid voltage fluctuations.
Output Current:
- The device can provide up to 100mA of continuous output current.
- Do not exceed this limit to prevent damage to the component.
Quiescent Current:
- The quiescent current is typically 10渭A at 5V.
- This value should be considered in low-power applications.
Thermal Management:
- The thermal resistance from junction to air is 120掳C/W.
- Ensure adequate cooling if the device will operate at high power levels or in high ambient temperatures.
Temperature Ranges:
- The operating temperature range is -40掳C to 85掳C.
- The storage temperature range is -65掳C to 150掳C.
- The maximum junction temperature is 150掳C. Ensure that the device does not exceed this temperature during operation.
Handling and Storage:
- Store the device in a dry, cool place within the specified storage temperature range.
- Handle with care to avoid static discharge, which can damage the component.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting.
- Ensure proper soldering and alignment to avoid mechanical stress on the component.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.
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