Details

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BUY SN74ALS04AN https://www.utsource.net/itm/p/12610006.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.75	-	5.25	V
Input Low Voltage	VIL	-	0	-	1.5	V
Input High Voltage	VIH	-	3.5	-	5.25	V
Output Low Voltage	VOL	IOL = 16 mA	0	-	0.4	V
Output High Voltage	VOH	IOH = -0.4 mA	2.7	-	5.25	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25°C	-	15	-	ns
Power Dissipation	PD	Per Package	-	-	380	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply input signals within the valid logic levels: V_IL ≤ 1.5V for a logical low, and V_IH ≥ 3.5V for a logical high.
   • Avoid applying voltages outside the V_CC range to prevent damage to the device.

3. Output Signals:

   • The output will be driven to V_OL ≤ 0.4V for a logical low and V_OH ≥ 2.7V for a logical high when the device is operating within its specifications.
   • Ensure that the load connected to the output does not exceed the maximum current ratings (I_OL = 16 mA, I_OH = -0.4 mA).

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 15 ns at V_CC = 5V and T_A = 25°C. This value can vary with temperature and supply voltage.

5. Thermal Considerations:

   • The device is designed to operate within a temperature range of -40°C to 85°C. Ensure proper heat dissipation if the device is expected to operate near the upper limit of this range.
   • Store the device in an environment with temperatures between -65°C and 150°C to avoid damage during storage.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.

7. Mounting:

   • Ensure proper alignment and soldering of the device to the PCB to avoid mechanical stress and ensure reliable electrical connections.
   • Use appropriate thermal management techniques, such as heatsinks or cooling fans, if necessary, to maintain the device within its operating temperature range.

(For reference only)