Details

---

BUY H669A https://www.utsource.net/itm/p/12610044.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VDD	2.0	-	5.5	V	Operating voltage range
Operating Current	IDD	-	1.5	3.0	mA	Quiescent current at VDD = 3.3V, no load
Output Current	IOUT	0	100	200	mA	Maximum output current
Output Voltage	VOUT	-	3.3	-	V	Output voltage at nominal conditions
Dropout Voltage	VDROPOUT	-	0.3	0.5	V	Dropout voltage at IOUT = 100mA
Load Regulation	-	-	0.5	1.0	%	Change in output voltage with load (0 to 100mA)
Line Regulation	-	-	0.1	0.3	%	Change in output voltage with input voltage (2.0 to 5.5V)
Ripple Rejection	-	-	60	70	dB	Power supply rejection ratio at 100Hz
Thermal Shutdown	TSD	-	150	-	掳C	Temperature at which the device shuts down to prevent damage
Storage Temperature	TSTG	-40	-	85	掳C	Temperature range for storage
Operating Temperature	TOPR	-40	-	85	掳C	Temperature range for operation

Instructions:

1. Power Supply Connection:

   • Connect the VDD pin to the positive terminal of the power supply.
   • Connect the GND pin to the negative terminal (ground) of the power supply.

2. Output Connection:

   • Connect the VOUT pin to the load or the circuit that requires regulated power.

3. Capacitors:

   • Place a 1渭F ceramic capacitor between VDD and GND as close to the H669A as possible to ensure stability.
   • Optionally, place a 10渭F electrolytic capacitor between VOUT and GND to improve transient response and reduce ripple.

4. Thermal Considerations:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
   • Use a heatsink if necessary to keep the device within its operating temperature range.

5. Overcurrent Protection:

   • The H669A has built-in overcurrent protection to prevent damage from excessive load currents.
   • If the output current exceeds the maximum rating, the device will limit the current and may shut down temporarily.

6. Thermal Shutdown:

   • The device will automatically shut down if the junction temperature exceeds 150掳C to prevent thermal damage.
   • Once the temperature returns to a safe level, the device will resume normal operation.

7. Storage and Handling:

   • Store the device in a dry, cool environment within the specified storage temperature range.
   • Handle the device with care to avoid static discharge and physical damage.

(For reference only)