2SK2007

2SK2007


Specifications
SKU
12610068
Details

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Parameter Symbol Value Unit
Drain Voltage VDS 450 V
Gate-Source Voltage VGS 卤20 V
Drain Current ID 10 A
Gate Leakage Current IGSS 卤100 nA
Transconductance gfs 6.0 S
Input Capacitance Ciss 1200 pF
Output Capacitance Coss 220 pF
Reverse Transfer Capacitance Crss 390 pF
Junction Temperature TJ -55 to 150 掳C
Storage Temperature Tstg -55 to 150 掳C

Instructions for Use:

  1. Mounting and Handling:

    • Handle the 2SK2007 with care to avoid damage to the leads and the device.
    • Ensure that the mounting surface is clean and flat to ensure good thermal contact.
  2. Biasing:

    • Apply the gate-source voltage (VGS) within the specified range of 卤20V to avoid damaging the gate.
    • Ensure that the drain-source voltage (VDS) does not exceed 450V to prevent breakdown.
  3. Thermal Management:

    • Use a heatsink if operating at high power levels to maintain the junction temperature (TJ) within the -55掳C to 150掳C range.
    • Ensure adequate ventilation to prevent overheating.
  4. Operational Limits:

    • Do not exceed the maximum drain current (ID) of 10A to avoid excessive heating and potential failure.
    • Monitor the gate leakage current (IGSS) to ensure it remains within 卤100nA to maintain device reliability.
  5. Storage:

    • Store the 2SK2007 in a dry, cool place with temperatures between -55掳C and 150掳C.
    • Avoid exposure to static electricity and handle with ESD protection.
  6. Testing:

    • Use a suitable test setup to measure parameters such as transconductance (gfs), input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss).
    • Follow standard testing procedures to ensure accurate measurements.
  7. Safety:

    • Always disconnect power before making any connections or adjustments.
    • Use appropriate safety gear when handling high voltages and currents.
(For reference only)

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