Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | Operating | 1.65 | 3.6 | V | |
| On Resistance | RON | VDD = 2.7V, IOUT = 1mA | 0.4 | 1.2 | 惟 | |
| Off Leakage Current | ILK | VDD = 0V, VS = 2.5V | 1 | nA | ||
| Switching Time | tSW | VDD = 2.7V, CL = 10pF | 5 | 15 | ns | |
| Power Dissipation | PD | Continuous | 480 | mW | ||
| Operating Temperature | TOPR | -40 | 85 | 掳C | ||
| Storage Temperature | TSTG | -65 | 150 | 掳C |
Instructions for TS5A63157DCKRE4
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of 1.65V to 3.6V to avoid damage and ensure proper operation.
On Resistance (RON):
- The on resistance can vary between 0.4惟 and 1.2惟 depending on operating conditions. Keep this in mind when designing circuits that are sensitive to resistance changes.
Off Leakage Current (ILK):
- When the device is off, the leakage current should not exceed 1nA. This ensures minimal power loss in the off state.
Switching Time (tSW):
- The switching time ranges from 5ns to 15ns under typical conditions. Ensure your application can accommodate these timing parameters.
Power Dissipation (PD):
- The maximum continuous power dissipation is 480mW. Design the circuit board with adequate heat dissipation if operating near this limit.
Operating Temperature (TOPR):
- Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.
Storage Temperature (TSTG):
- Store the device in environments where temperatures range from -65掳C to 150掳C to prevent damage during storage.
Handling Precautions:
- Handle with care to avoid electrostatic discharge (ESD) damage. Use appropriate ESD protection measures when handling or installing the component.
Mounting and Soldering:
- Follow recommended soldering profiles and mounting guidelines provided by the manufacturer to ensure proper installation and functionality.
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