Details
BUY IRF840BPBF https://www.utsource.net/itm/p/12610108.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source On-Resistance | RDS(on) | - | 0.55 | - | 惟 | VGS = 10V, ID = 1A |
| Gate-Source Threshold Voltage | VGS(th) | 2.0 | - | 4.0 | V | ID = 250渭A |
| Continuous Drain Current | ID | - | - | 8.0 | A | TC = 25掳C |
| Pulse Drain Current | IDM | - | - | 32 | A | tPW = 10ms, Duty Cycle = 1% |
| Total Power Dissipation | PD | - | - | 95 | W | TC = 25掳C |
| Junction Temperature Range | TJ | -55 | - | 175 | 掳C | |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C |
Instructions for Use:
Handling Precautions:
- The IRF840BPBF is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection equipment.
Mounting:
- Ensure good thermal contact between the device and the heat sink to maximize power dissipation.
- Torque screw mounting as specified by manufacturer guidelines to avoid damage.
Biasing:
- Apply gate voltage carefully to avoid exceeding the maximum ratings.
- For optimal performance, operate within the recommended operating conditions.
Pulse Operation:
- When using in pulse mode, ensure that the duty cycle does not exceed the specified limit to prevent overheating.
Storage:
- Store in a dry, cool environment to prevent moisture damage and maintain component integrity.
Testing:
- During testing, do not exceed the maximum drain current or total power dissipation limits to avoid damaging the device.
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